Short product description:
The DeLOCK 18475 thermal pad offers a thermal conductivity of 3 W/m·K, making it suitable for efficient heat transfer in electronic devices. It measures 20 mm in width, 120 mm in depth, and 0.5 mm in height, providing a versatile solution for various applications. The grey color and polybag packaging ensure easy handling and storage. Manufactured in China and Taiwan, this product is designed to enhance cooling performance.