Stacionārais dators ActiveJet PC Actina ar Intel Core i3-8100 3.6 GHz, 8 GB DDR4, 240 GB SSD, Windows 10 Pro, melns

Skata lodziņš: Transparent window in the device, which is created to view the progress of performance.

Nē

Atjaunots:

Nē

Iekšējās sastāvdaļas:

MSI H310M PRO-VDH PLUS / GOODRAM DDR4 / SSD GOODRAM CL100 Gen.2 240GB / ACTINA L12

Papildus informācija

Īpašās funkcijas:

Specyfikacja oraz opis mają charakter poglądowy.

Instalēto procesoru skaits: Number of processors in the product.

1

Komutatora tips: The type of rigid framework onto which is the hosuing for device components.

Mini Tower

Kabeļa likšanas tehnoloģija: Type of cable technology performance.

10/100/1000Base-T(X)

Barošanas avots: The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.

300 W

Mātes plates formas faktors: Design of the motherboard (ATX, BTX etc).

Micro ATX

Line-in:

Jā

Line-out:

Nē

Ekrāns iekļauts: This product includes a display.

Nē

Audio izvades kanāli: An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.

7.1

5.25 " nodalījumu skaits: A drive bay is a standard-area for adding hardware to a computer. Most drive bays are fixed to the inside of a case, but some can be removed. A 5.25" drive bay, also known as full-height bays, were found in old PCs in the early to mid-1980s. They were 3¼″ high by 5¾″ wide, and up to 8″ deep (83 × 146 × 200 mm), used mainly for hard disks and floppy disk drives.

1

3.5 " nodalījumu skaits: A drive bay is a standard-area for adding hardware to a computer. Most drive bays are fixed to the inside of a case, but some can be removed. A 3.5" drive bay is for floppy disks.

2

Tirgus pozicionēšana: Under which category can the device be positioned in the market, e.g. camera phone.

Bizness

Gatavs virtuālajai realitātei (VR):

Nē

Procesors īpašas iezīmes

Atbalstāmie instrukciju komplekti:

AVX 2.0, SSE4.1, SSE4.2

Intel® Identity Protection Technology (Intel® IPT): Protect Your Identity and Business Intel® Identity Protection Technology (Intel® IPT) protects enterprises from being penetrated by stolen credentials and online user account access with an added layer of hardware-based security and authentication as well as a multifactor authentication framework to manage different authentication methods.

Jā

Intel® Hyper Threading Technology (Intel® HT Technology): Improved Performance for Threaded Software Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.

Nē

Intel® Quick Sync Video Technology: Create, Edit, and Share Video in a Flash Intel® Quick Sync Video uses the dedicated media processing capabilities of Intel® Graphics Technology to make video encoding tasks—such as creating DVDs or Blu-ray discs, creating and editing 3D videos, converting 2D video files into 3D, and converting video for portable media players and social networking sites—faster and easier.

Jā

Intel® InTru™ 3D Technology: Add a new dimension to your viewing experience. Now you can play games and watch your favorite 3D movies with Blu-ray Stereo 3D playback using passive or active shutter 3D glasses. InTru™ 3D technology by Intel in association with Dreamworks delivers it all in 1080p full high-definition resolution on your TV over HDMI 1.4.

Jā

Intel® Clear Video HD Technology (Intel® CVT HD): See the World More Vividly Intel® Clear Video HD Technology delivers cleaner, sharper images, more natural, accurate, and vivid colors. View images as they were meant to be seen on devices featuring Intel® Core™ processors with Intel® Graphics Technology.

Jā

Intel® AES New Instructions (Intel® AES-NI): Added Security with Faster Data Encryption The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.

Jā

Intel® Trusted Execution Technology:

Nē

Mērogojamība:

1S

Intel® Enhanced Halt State:

Jā

Intel® Clear Video Technology for Mobile Internet Devices (Intel® CVT for MID):

Jā

Intel® VT-x with Extended Page Tables (EPT):

Jā

Iegultās opcijas pieejamas:

Jā

Intel® Secure Key: Generate Cryptographic Security Protocols Intel® Secure Key is a security hardware-based random number generator that can generate high-quality keys for cryptographic (encryption and decryption) protocols. These keys provide quality entropy that is highly sought after in the cryptography world for added security.

Jā

Termālā risinājuma specifikācija: Intel Reference Heat Sink specification for proper operation of this SKU.

PCG 2015C

Intel® Stable Image Platform Program (SIPP):

Nē

Intel® Virtualization Technology for Directed I/O (VT-d): Simplify Virtualization and Reduce Overheads Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.

Jā

Intel® Clear Video Technology:

Jā

Intel® Identity Protection Technology version:

1.00

Intel® Secure Key Technology version:

1.00

Intel® Virtualization Technology (VT-x): Simplify Virtualization and Reduce Overheads Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.

Jā

Intel® Stable Image Platform Program (SIPP) version:

0

Intel® TSX-NI version:

0.00

Procesora paketes izmērs:

37.5 x 37.5

Intel® OS Guard: Protect Your Operating Environment Intel® OS Guard, a hardware-based security feature that protects the operating system kernel, defends against malicious data or attack code located in areas of memory marked as user mode pages, preventing any application from taking over or compromising the OS kernel.

Jā

Izpildes atspējošanas bitu līdzekļi:

Jā

Intel® Software Guard Extensions (Intel® SGX):

Jā

Siltuma uzraudzības tehnoloģijas:

Jā

Enhanced Intel SpeedStep tehnoloģija:

Jā

Idle States:

Jā

Intel® TSX-NI:

Nē

Intel® 64:

Jā

Darbības rādītāji

Audio mikroshēma:

Realtek ALC887

Mātes plates chipset: The chipset connects the microprocessor to the rest of the motherboard.

Intel® H310

Produkta veids: The sub-category of the product.

PC (dators)

Optiskās diskierīces tips: An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.

Nē

Trusted Platform Module (TPM):

Jā

Savienojamība

SATA III savienotāju skaits: Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.

4

S/PDIF out pieslēgvieta: S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.

Nē

PS/2 pieslēgvietu skaits: The number of PS/2 connectors for keyboards and mice. Its name comes from the IBM Personal System/2.

1

Thunderbolt 3 pieslēgvietu skaits:

0

Austiņu izejas: Number of sockets /ports where headphones are connected.

1

Mikrofons, līnijas izeja: The socket where a microphone is connected to the device.

Jā

DVI pieslēgvieta: Digital Visual Interface (DVI) is a video display interface to connect a video source to a display device, such as a computer monitor.

Jā

VGA (D-Sub) pieslēgvietu skaits: Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.

1

HDMI pieslēgvietu skaits: HDMI ir ciparu savienotājs, ar kura palīdzību var pieslēgt televizoru, projektoru un citas ierīces, kas nodod attēlu portatīvajam datoram. Atšķirībā no VGA, HDMI nodod skaņu un attēlu bez traucējumiem un augstā izšķirtspējā ( HD, Full HD – ja ir pieejams).

1

USB 2.0 pieslēgvietu skaits: Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.

4

DisplayPorts daudzums: Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.

0

USB 3.2 Gen 2 (3.1 Gen 2) C tipa pieslēgvietu skaits: Ar jauno USB 3.0 specifikāciju saderīgās ierīces sasniedz 5 Gbit/s (640 MB/s) ātrdarbību. Tas ir 10 reižu vairāk, nekā USB 2.0, kura datu pārsūtīšanas ātrums – 480Mbit/s (42MB/s). USB 3.0 savienojums tiek atzīmēts zilā krāsā.

0

USB 3.2 Gen 2 (3.1 Gen 2) A tipa pieslēgvietu skaits: Ar jauno USB 3.0 specifikāciju saderīgās ierīces sasniedz 5 Gbit/s (640 MB/s) ātrdarbību. Tas ir 10 reižu vairāk, nekā USB 2.0, kura datu pārsūtīšanas ātrums – 480Mbit/s (42MB/s). USB 3.0 savienojums tiek atzīmēts zilā krāsā.

0

Ethernet LAN (RJ-45) pieslēgvietu skaits: Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.

1

USB 3.2 Gen 1 (3.1 Gen 1) C tipa pieslēgvietu skaits: Ar jauno USB 3.0 specifikāciju saderīgās ierīces sasniedz 5 Gbit/s (640 MB/s) ātrdarbību. Tas ir 10 reižu vairāk, nekā USB 2.0, kura datu pārsūtīšanas ātrums – 480Mbit/s (42MB/s). USB 3.0 savienojums tiek atzīmēts zilā krāsā.

0

USB 3.2 Gen 1 (3.1 Gen 1) A tipa pieslēgvietu skaits: Ar jauno USB 3.0 specifikāciju saderīgās ierīces sasniedz 5 Gbit/s (640 MB/s) ātrdarbību. Tas ir 10 reižu vairāk, nekā USB 2.0, kura datu pārsūtīšanas ātrums – 480Mbit/s (42MB/s). USB 3.0 savienojums tiek atzīmēts zilā krāsā.

4

Tīklošana

Bluetooth: Bluetooth ir bezvadu tīkls datu pārraidei starp mobilajām ierīcēm un to piederumiem (telefoniem, bezvadu austiņām u.c.), kā arī tas ļauj nosūtīt datus no mobilās ierīces uz datoru un otrādi.

Nē

Ethernet/LAN savienojums: An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.

Jā

Ethernet LAN datu pārsūtīšanas ātrums: The different speed levels of the Ethernet LAN connection.

10, 100, 1000

Wi-Fi: WiFi ir bezvadu ierīce savienojumam ar tīklu. Mūsdienās jaunākais ir 802.11 B/G/N/AC pieslēgums, kuram ir augstākā ātrdarbība (150 - 900Mb/s) un drošība. Ar 802.11 B/G arī var pieslēgties praktiski visiem tīkliem, tikai maksimālā ātrdarbība pieslēdzoties N vai AC tipa tīklam būs 54 Mb/s.

Nē

Dizains

2,5" izmēra laidumu skaits:

2

80 PLUS sertifikācija:

80 PLUS

VESA stiprinājums:

Nē

Ūdens dzesēšanas sistēma: System using water to remove heat from a machine or system.

Nē

Apvalka materiāls: What the casing of the product is made of.

Metāls, Plastmasa

Produkta krāsa: The colour e.g. red, blue, green, black, white.

Melns

Paplašināšanas sloti

PCI Express X1 (Gen 2.x) sloti:

2

PCI Express konfigurācijas:

1x16, 1x8+2x4, 2x8

PCI Express x16 (Gen 3.x) sloti: Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.

1

Grafika

Grafikas adaptera DisplayPorts skaits:

0

Grafikas adaptera HDMI portu skaits:

1

Grafikas adaptera VGA (D-Sub) portu skaits:

1

Grafikas adaptera DVI-D portu skaits:

1

Izpildes vienību skaits:

23

Iebūvētā grafikas adaptera ID:

0x3E91

NVIDIA G-SYNC:

Nē

NVIDIA GameWorks VR:

Nē

Iebūvēto grafisko adapteru atbalstīto displeju skaits: The feature may not be available on all computing systems. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

3

Iebūvētā grafikas adaptera DirectX versija:

12.0

Iebūvētā grafikas adaptera OpenGL versija:

4.5

Iebūvētā grafikas adaptera bāzes frekvence:

350 MHz

Iebūvētā grafikas adaptera dinamiskā frekvence (max):

1100 MHz

Integrēts grafikas adapteris: Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing.

Jā

Maksimālā iebūvētā grafikas adaptera atmiņa:

64 GB

Diskrētais grafikas adaptera modelis: A graphics adapter (often known as a video card) generates images for a display. A discrete graphics adapter plugs into the motherboard, and usually produces much better graphics than an integrated graphics adapter. There are various models of discrete graphics adapters.

Nav pieejams

Diskrētais grafikas adapteris:

Nē

Svars&dimensijas

Svars: Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.

10 kg

Augstums: The measurement of the product from head to foot or from base to top.

284 mm

Dziļums: The distance from the front to the back of something.

328 mm

Platums: The measurement or extent of something from side to side.

132 mm

Procesors

Procesora atbalstīti atmiņas pulksteņa ātrumi:

2400

Procesora atbalstīta atmiņas veidi:

DDR4-SDRAM

Procesora atbalstīta maksimālā iekšējā atmiņa:

64 GB

Procesors, kurā nav izmantoti konflikta materiāli: "Conflict free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.

Jā

PCI Express slotu versija:

3.0

Procesora darbības režīmi: Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.

64 biti

Centrālā procesora konfigurācija (maks.):

1

Tjunction:

100 °C

Kopnes tips:

DMI3

Procesora kodētais nosaukums:

Coffee Lake

PCI Ekspress joslu maksimālais skaits:

16

Procesors ARK ID:

126688

Procesora atbalstīts (max) atmiņas joslas platums:

37.5 GB/s

Thermal Design Power (TDP):

65 W

Procesora ligzda: Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.

LGA 1151 (Ligzda H4)

Kopnes datu pārraides ātrums: A bus is a communication system that transfers data between components inside a computer, or between computers. The system bus rate is the speed at which data is transferred in this communication system.

8 Gigatransferi sekundē (GT/s)

Procesora kešatmiņas veids:

Viedā kešatmiņa

Procesora kešatmiņa: Kešatmiņa (Cache - krātuve) ir atmiņas veids, ko izmanto datora procesors, lai samazinātu vidējo piekļūšanas laiku operatīvajai atmiņai. Tai ir ļoti būtiska nozīme pamatplates un cietā diska ātrdarbības.

6 MB

Procesors litogrāfija: The process which is performed by the processor e.g. CPU (Central Processing Unit).

14 nm

Procesora stieples:

4

Procesora modelis: The model number for the processor in a computer.

i3-8100

Procesora frekvence: Procesora takts frekvences vērtība izsakāma gigahercos (GHz). Jo augstāka takts frekvence, jo procesors ātrāk pilda mūsu komandas.

3.6 GHz

Multikodola tips: The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).

4

Procesora ražotājs: The manufacturer that produced the processor.

Intel

Datu uzglabāšanas līdzekļi

Integrēts karšu lasītājs: A card reader is a device that enables reading and, in some cases, writing data to and from a memory card.

Nē

SSD formas standarts: The size of the solid-state drive, given in inches

2.5"

Intel® Optane™ Atmiņas modulis instalēts:

Nē

SSD diskdziņa interfeisi: The type of interface(s) with which the Solid State Drive is connected to other hardware.

SATA III

SSD diskdziņa kapacitāte: Tas ir uz flash atmiņas tehnoloģijas balstītā datu uzkrāšanas ierīce. SSD diski izceļas ar augstu efektivitāti, pateicoties ātram reakcijas laikam un tam, ka tajos netiek izmantotas nekādas kustīgas daļas.

240 GB

Skaits uzstādīto SSD:

1

Kopējā SSD ietilpība:

240 GB

Atbalstītais uzglabāšanas diskdziņu skaits: How many storage drives can be fit into the product at once.

4

Uzstādīto atmiņas/glabāšanas disku skaits: Amount of storage drives built into the device.

1

Uzglabāšanas nesējs: Used for the storage of data e.g. HDD (hard disk drive), SSD (solid-state drive).

SSD

Kopējā glabāšanas ietilpība: The total amount of data that can be stored on the device.

240 GB

Atmiņa

ECC: ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.

Nē

Atmiņas kanāli:

Viens kanāls

Atmiņas taktātrums: The frequency at which the memory (e.g. RAM) runs.

2666 MHz

Atmiņas sloti: Number and type of memory expansion slots, including connector and memory module descriptions.

2x DIMM

Maksimālā iekšējā atmiņa: The maximum internal memory which is available in the product.

32 GB

Atmiņas izkārtojums: The slots and size of the memory for the CPU.

1 x 8

Iekšējās atmiņas tips: The type of internal memory such as RAM, GDDR5.

DDR4-SDRAM

Iekšējā atmiņa: Operatīvā atmiņa (no angļu valodas RAM - Random Access Memory) ir īslaicīga datu krātuve.

8 GB

Enerģijas pārvaldība

Barošanas avota ieejas spriegums:

100-240

Programmatūra

Operētājsistēma arhitektūra: The way in which the operating system of a computer/smartphone (32-bit/64-bit) is set up.

64 biti

Nodrošināta operētājsistēma: Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.

Windows 10 Pro