We are comparing AG TermoPasty Thermal Conductive Pad 20 x 130 mm, 1.5 mm thickness with similar alternatives from the same brand: thermal pads AG TermoPasty ART.AGT-140 Thermal Pad 20 x 130 mm 1 mm, AG TermoPasty AG Thermopad Thermal Pad 20 x 130 mm x 2 mm, Thermal Pad AG TermoPasty 20x130x3,0mm 6 W/mK, as well as thermal pastes Thermal Conductive Paste AG TermoPasty H 25 g by AG TermoPasty and Thermal Conductive Paste AG TermoPasty AG-CARBO/3G Carbon 3 g. All of these products are designed to facilitate heat dissipation between electronic components and heatsinks, but they differ in format (pads versus pastes) and physical dimensions, particularly pad thickness, which dictates their compatibility with specific component gaps.
⚙️ Below is a comparison of key characteristics such as product type, dimensions, thickness, and intended use for each option.
| Parameter | AG TermoPasty Thermal Conductive Pad 1.5 mm | AG TermoPasty ART.AGT-140 (1 mm) | AG TermoPasty AG Thermopad (2 mm) | Thermal Pad AG TermoPasty (3 mm, 6 W/mK) | Thermal Conductive Paste H 25 g | Thermal Conductive Paste AG-CARBO/3G | Practical significance |
|---|
| Product type | Thermal pad | Thermal pad | Thermal pad | Thermal pad | Thermal paste | Thermal paste | Pads are convenient for filling fixed gaps, while pastes are applied in thin layers between direct mating surfaces. |
| Width and length | 20 x 130 mm | 20 x 130 mm | 20 x 130 mm | 20 x 130 mm | Not applicable | Not applicable | The thermal pads share identical surface dimensions to cover standard components. |
| Thickness / Quantity | 1.5 mm | 1.0 mm | 2.0 mm | 3.0 mm | 25 g | 3 g | Varying pad thicknesses are critical for matching exact hardware gaps; pastes serve direct contact application. |
| Main purpose | Heat dissipation between components and heatsinks | Effective heat dissipation in computers and electronics | Improving heat transfer in cooling systems | Efficient heat dissipation in PCs and consoles | For CPUs, GPUs, and power transistors | For CPUs and GPUs under normal and high loads | All products prevent overheating but are optimized for different hardware placements and installation methods. |
◎ The table below evaluates which product is more suitable for different user needs and application scenarios.
| Use case | Recommended product | Why |
|---|
| Filling a 1.5 mm gap between a chip and a heatsink | AG TermoPasty Thermal Conductive Pad 20 x 130 mm, 1.5 mm thickness | Provides the precise thickness required for correct physical contact and thermal transfer in this specific gap. |
| Installation in tight spaces with a 1 mm clearance | AG TermoPasty ART.AGT-140 Thermal Pad 20 x 130 mm 1 mm | A thinner profile fits well in compact components and tight assemblies. |
| Bridging wider gaps (2 mm or 3 mm) | AG TermoPasty AG Thermopad 2 mm or Thermal Pad AG TermoPasty 3,0mm | Greater thickness effectively spans larger distances between components and remote heatsinks. |
| Direct application onto bare CPU or GPU dies | Thermal Conductive Paste AG TermoPasty H 25 g or AG-CARBO/3G Carbon 3 g | Paste fills microscopic surface irregularities better than pads, ensuring minimal thermal resistance for direct die contact. |
Choosing between AG TermoPasty Thermal Conductive Pad 20 x 130 mm, 1.5 mm thickness and alternatives depends on your hardware layout. This 1.5 mm model is ideal if your device requires precisely this clearance between the component and the heatsink. If your gap differs, select a pad of the corresponding thickness, or use thermal paste when applying directly to bare silicon dies.
