Thermal Grease AG TermoPasty Smar Molibdenowy 100 ml (molybdenum disulfide)

AG TermoPasty Smar Molibdenowy 100 ml is a thermal grease formulated with molybdenum disulfide (MoS2) to improve thermal contact between electronic components and heat-dissipating surfaces. Supplied in a 100 ml tube, this compound fills microscopic surface irregularities to reduce thermal resistance and promote more efficient heat transfer. It is intended for use where reliable thermal coupling is required, such as between CPUs, power transistors, LED modules and heatsinks in electronic cooling systems.

Advantages

The molybdenum disulfide additive enhances thermal conductivity and provides stable performance under varying temperatures. The paste remains pliable to ensure lasting contact without hardening or significant drying. Its tube packaging allows controlled application and reduces waste. The formulation is electrically non-conductive and formulated to minimize pump-out in steady-state thermal cycling, supporting consistent thermal transfer over time.

Suitable for

• Thermal interface between CPUs and heatsinks in computers and servers
• Power transistors and MOSFETs on heatsinks in power electronics
• LED modules and luminaires requiring efficient heat dissipation
• Electronic assemblies and thermal management of compact devices

Key specifications

• Active filler: molybdenum disulfide (MoS2)
• Form: paste/grease
• Volume: 100 ml tube
• Application: thermal interface material for electronic cooling
• Electrical behavior: non-conductive under normal use (verify compatibility with sensitive circuits)
• Temperature stability: formulated for repeated thermal cycling (refer to manufacturer data for exact limits)

How to use

Prepare mating surfaces by cleaning them of dust, old thermal compound and oils using isopropyl alcohol or a suitable cleaner, then allow to dry. Apply a thin, even layer of the molybdenum disulfide thermal paste to the component surface or the heatsink contact area; excess can be removed after mounting if necessary. Mount the heatsink or cooler according to the device manufacturer's instructions, ensuring even pressure to spread the paste and eliminate air gaps. Reassemble and test thermal performance under normal operating conditions.

Usage recommendations

For optimal results, use a minimal uniform layer to avoid excess paste that can impede heat transfer. Reapply the paste when replacing coolers or after long service intervals. Keep the tube capped when not in use and store in a cool, dry place away from direct sunlight. Follow device manufacturer guidance for compatibility with specific components and operating temperatures.