Thermal Conductive Paste AG TermoPasty Carbon 1 g thermal compound for heat transfer

AG TermoPasty Carbon 1 g thermal compound is a carbon-based thermal conductive paste supplied in a compact 1 g package for precise application. Designed to improve heat transfer between heat-generating components and heatsinks, this thermal interface material fills microscopic surface irregularities and displaces air to reduce thermal resistance. Its small format makes it suitable for targeted repairs and precision electronics work where controlled application is required.

Advantages

The carbon formulation provides stable thermal conductivity without the electrical conductivity risks associated with some metal-based pastes, allowing safer use near sensitive circuitry. The 1 g syringe enables accurate dosing and minimal waste for single-component applications. Its texture spreads thinly to form an even contact layer, improving cooling efficiency of CPUs, GPUs, power transistors and LED modules while remaining easy to apply and remove during maintenance.

Suitable for (tasks / use cases)

• Reapplying thermal interface material on desktop and laptop CPUs for small repairs
• Improving heat transfer in discrete GPUs and small graphics modules
• Thermal coupling of power transistors and voltage regulators on PCBs
• Enhancing cooling of high-power LEDs and LED modules in lighting fixtures
• Precision electronics maintenance and prototype thermal testing

Key specifications

• Base material: carbon-based thermal compound
• Package weight: 1 g, syringe format for precision application
• Primary function: thermal interface material for heat transfer between components and heatsinks
• Application type: thin-layer spreading for filling microscopic gaps and improving contact
• Typical use environment: electronic assemblies including CPUs, GPUs, power semiconductors and LED modules

How to use

Clean both mating surfaces thoroughly to remove old compound, dust and oils. Apply a small, controlled amount of the thermal paste from the syringe onto the center of the component surface, then mount the heatsink and press evenly to spread a uniform thin layer. Avoid excessive application; a thin continuous layer is sufficient to ensure efficient heat transfer. After use, cap the syringe to prevent drying and store in a cool, dry place away from direct sunlight.

Usage recommendations

Use this carbon-based paste when electrical non-conductivity is required and when precise, low-volume application is needed. For best results, follow component manufacturer torque and mounting instructions when attaching heatsinks, and replace thermal paste during scheduled maintenance or when thermal performance degrades.