Thermal Paste AG TermoPasty Smar TF teflon-silicone 65 ml

AG TermoPasty Smar TF teflon-silicone 65 ml is a thermal paste formulated to enhance heat transfer between electronic components and heat sinks. Supplied in a 65 ml tube, this compound is designed for use where stable thermal contact, gap filling and corrosion protection are required. The teflon-silicone base offers a balance of thermal conductivity and ease of application for maintenance and repair tasks on CPUs, power transistors, LED modules and other heat-generating devices.

Advantages

The teflon-silicone composition provides effective gap filling and maintains consistent contact under thermal cycling. Its formulation reduces the risk of corrosion on metal surfaces while ensuring mechanical stability over repeated temperature changes. Packaged in a 65 ml tube, the product supports multiple applications and workshop use, allowing precise dispensing and controlled coverage. The compound is electrically non-conductive and remains stable within typical operating temperature ranges for electronic cooling interfaces.

Suitable for

• Desktop and server CPUs during maintenance and repairs
• Power transistors and MOSFETs in power electronics
• LED modules and high-power lighting assemblies
• Heat sink mounting and replacement on industrial control boards
• Cooling upgrades and thermal interface renewal in consumer electronics

Key specifications

• Volume: 65 ml tube
• Base: teflon-silicone thermal compound
• Function: gap filling and thermal interface enhancement
• Electrical behaviour: non-conductive
• Application type: manual dispensing from squeeze tube

How to use

Prepare surfaces by powering off equipment and allowing components to cool. Clean both the component and heat sink contact areas from old thermal compound, oils and debris using isopropyl alcohol or a suitable solvent, then dry completely. Apply a thin, even layer of the teflon-silicone paste to the component surface or heat sink according to the contact area size. Reassemble the heat sink and apply even mounting pressure to spread the compound and ensure full contact. Avoid over-application; a thin continuous layer provides optimal thermal transfer.

Usage recommendations

For repeatable results, use lint-free wipes and solvent-cleaned surfaces. When working with CPUs or precision components, follow manufacturer torque specifications for heat sink mounting to avoid uneven pressure. Store the tube capped in a cool, dry place and avoid contamination of the paste during use.