Thermal conductive paste AG TermoPasty AG TermoGlue 10 g – thermal interface compound, tube

AG TermoPasty AG TermoGlue 10 g is a thermal conductive paste supplied in a squeezable tube and formulated to improve heat transfer between electronic components and heatsinks. The compound fills microscopic surface imperfections and air gaps to reduce thermal resistance and promote efficient dissipation of heat from CPUs, GPUs, power transistors and other heat-generating parts in PCs and electronic equipment.

Advantages

The paste offers consistent thermal conductivity and a stable, easily applied texture that spreads evenly under a mounting pressure. Its formulation is designed to remain compliant over time, maintaining contact between mating surfaces to reduce hotspots. The tube format enables precise application and convenient storage of the remaining product between uses.

Suitable for

• CPU and GPU heat sinks in desktop and workstation computers
• Power transistors and MOSFETs on power boards
• Chipsets, voltage regulators and other PCB-mounted heat-generating components
• Repair and maintenance tasks where improved thermal conduction is needed

Key specifications

• Form: thermal conductive paste in a squeezable tube
• Net weight: 10 g
• Primary function: fills microscopic gaps to improve thermal contact
• Application type: manual dispensing and spreading between component and heatsink
• Compatibility: suitable for common semiconductor packages and heatsink interfaces

How to use

Ensure both mating surfaces are clean, dry and free of old thermal compound, dust or grease before application. Apply a small, controlled amount of the paste to the center of the component heat source or directly onto the heatsink contact area, depending on mounting method. Mount the heatsink and secure it using the recommended pressure and pattern for your hardware to obtain an even, thin bond line. If needed, remove excess compound around the edges with a lint-free cloth and isopropyl alcohol. Follow device manufacturer guidelines for torque and mounting sequence when reassembling.

Usage recommendations

The product is intended for stationary electronic assemblies; avoid applying on live contacts or where electrical conductivity could create shorts. Store the tube capped and in a cool, dry place. Replace the compound during major maintenance or after removal of heatsink if thermal performance degrades.