AG TermoPasty RF800 50 ml is a medium-activity thermal paste formulated to improve heat transfer between electronic components and heatsinks. Packaged in a syringe-style dispenser, this thermal compound facilitates controlled application and uniform coverage on CPUs, GPUs, power transistors and other heat-generating elements. The medium thermal conductivity and balanced viscosity make it suitable for repair, assembly and routine maintenance where reliable thermal interface performance is required.
Advantages
The compound offers consistent spreadability from the syringe dispenser, enabling thin, even layers that reduce air gaps and improve contact between surfaces. Its medium activity provides effective heat conduction without requiring extreme pressure or special curing procedures. The formulation is non-curing and remains stable under typical operating temperatures, supporting predictable thermal behavior during device operation and after rework.
Suitable for
- Thermal interface between CPUs and heatsinks in desktop systems
- GPU cooling and replacement of degraded thermal pads
- Power transistor and MOSFET thermal management on amplifier or power supply boards
- General repair, assembly and preventive maintenance of electronics
Key specifications
- Volume: 50 ml syringe-style dispenser
- Activity level: medium (balanced viscosity and conductivity)
- Consistency: paste suitable for even application and thin layers
- Application temperature range: suitable for common electronic operating temperatures
- Shelf and operational stability: non-curing, stable under normal device conditions
How to use
Clean both mating surfaces thoroughly to remove old thermal compound, grease and dust, using isopropyl alcohol or an appropriate solvent and a lint-free cloth. Apply a small, controlled amount of the RF800 thermal paste from the syringe onto the center of the chip or heatsink contact area. Mount the heatsink and apply even pressure to spread the paste into a thin, continuous layer; avoid excessive amounts that can impede thermal transfer. If reworking, remove excess paste and inspect contact area for uniform coverage.
Usage recommendations
For best results, use a pea-sized or rice-grain amount for standard CPU dies and slightly larger amounts for bigger heat spreaders; always follow the device manufacturer’s mounting instructions and allow components to reach operating temperature to verify thermal performance. Store the syringe capped in a cool, dry place to preserve consistency between uses.
