Thermal Paste AG TermoPasty Towot maszynowy 65 ml AGT-078

AG TermoPasty Towot maszynowy 65 ml (AGT-078) is a high-viscosity thermal conductive paste supplied in a cartridge designed for machine dispensing. Formulated to fill microscopic gaps between heatsinks and components, this thermal paste improves heat transfer and helps lower operating temperatures in electronic assemblies. The cartridge format and rheology make it suitable for repetitive application in production lines and service environments where controlled, uniform deposition is required.

Advantages

This thermal paste features elevated viscosity that prevents runoff while ensuring intimate contact with surface irregularities, resulting in stable thermal performance. The cartridge delivery enables precise, repeatable dosing with dispensing equipment, reducing material waste and variability. The composition is tailored for electronics assembly and repair, offering reliable thermal conductivity without conductive particulates that could cause short circuits when applied correctly.

Suitable for

• Filling gaps between heatsinks and power semiconductors in electronic assemblies
• Automated dispensing in production and repair workshops
• Thermal interface applications in power supplies, LED modules, and industrial controllers
• Service and maintenance tasks requiring consistent paste application

Key specifications

• Form: high-viscosity paste in a 65 ml cartridge
• Delivery method: machine/dispensing equipment compatible cartridge
• Primary function: thermal interface material for improved heat transfer
• Application temperature range: suitable for typical electronic operating temperatures (ambient to elevated component temperatures)
• Compatibility: formulated for use between metal or ceramic heatsinks and electronic components

How to use

Install the cartridge into a compatible dispensing gun or automated dispenser. Prepare mating surfaces by cleaning off old thermal compound, grease, and debris with isopropyl alcohol and allowing surfaces to dry. Dispense an appropriate amount of paste onto the heatsink or component according to the equipment settings and desired bond line thickness; avoid excessive application. Assemble the heatsink and component, applying even pressure to spread the paste and ensure full contact. Follow curing or settling times if specified by the production process before powering the device.

Usage recommendations

Use dispensing equipment calibrated for paste viscosity to achieve consistent deposition. Store cartridges in a cool, dry place and avoid freezing temperatures. Wear gloves to prevent contamination of the thermal interface and follow ESD and safety procedures relevant to electronic assembly work.