Thermal Paste AG TermoPasty AGT-079, graphite compound, 65 ml syringe

AG TermoPasty AGT-079 graphite thermal paste in a 65 ml syringe is a heat-conductive compound formulated to improve thermal contact between electronic components and heatsinks. The graphite-based composition fills microscopic surface irregularities on CPUs, GPUs, power modules and other heat-generating components, reducing thermal resistance and promoting more efficient heat transfer. Supplied in a syringe for controlled application, this product is intended for professional and advanced amateur maintenance of electronic cooling systems where a graphite compound is preferred.

Advantages

The graphite formulation provides stable thermal conductivity and does not cure into a hard layer, maintaining contact over extended service intervals. The 65 ml syringe offers a large volume for multiple applications and controlled dispensing reduces waste and contamination. The compound is electrically non-conductive (graphite-based thermal interface materials typically have low electrical conductivity risks when applied properly) and remains pliable to accommodate slight component movement and thermal cycling.

Suitable for

• Desktop and server CPUs and GPUs
• Power modules, MOSFETs and voltage regulators
• Industrial electronics and embedded systems cooling
• Repair shops and system assembly where bulk thermal compound is required

Key specifications

• Formulation: graphite-based heat-conductive compound
• Container: 65 ml syringe for precise application
• State: viscous paste suitable for spreading or dispensing
• Primary function: fill microscopic gaps to improve thermal contact
• Compatibility: suitable for metal heatsinks and common electronic component surfaces

How to use

Clean both mating surfaces thoroughly to remove old compound, dust and oils using an appropriate solvent and lint-free cloth. Apply an even, thin layer of the graphite paste from the syringe to the centre of the component or onto the heatsink surface depending on component size and thermal interface design. Reassemble the cooler, ensuring even pressure across the contact area so the paste spreads and fills surface irregularities. Remove excess paste immediately and verify secure mechanical mounting according to the device manufacturer’s instructions.

Usage recommendations

For consistent thermal performance, use a thin, uniform layer and avoid over-application which can hinder heat transfer. Store the syringe capped in a cool, dry place and follow safety precautions for handling thermal compounds. When working with high-power modules, monitor temperatures after reassembly to confirm expected thermal improvement.