Thermal paste Akasa T6 ProGradePlus 4 g — high-performance CPU/GPU thermal compound

Akasa T6 ProGradePlus 4 g is a thermal paste formulated to improve heat conduction between processors and cooling solutions. Supplied in a small applicator tube, this thermal compound is intended for use when mounting CPUs or GPUs, reapplying paste during maintenance, or replacing worn thermal interfaces. The neutral consistency balances ease of application with reliable contact across small surface irregularities to assist in reducing operating temperatures and improving overall cooling efficiency.

Advantages

The compound provides stable thermal conductivity and a non-electrically conductive composition suitable for processor and graphics chip interfaces. Its paste-like viscosity allows for controlled application from a small tube, supporting thin, even layers that optimize contact with heatsinks. The 4 g volume is sized for multiple small-area applications or several individual repastes, reducing waste while remaining convenient for technicians and system builders.

Suitable for

• Mounting new CPUs or GPUs in desktop systems
• Re-pasting processors during routine maintenance
• Small-form-factor builds where precise application is required
• Repair and upgrade work by technicians and DIY builders

Key specifications

• Net weight: 4 grams of thermal compound
• Form: viscous paste in a squeezable tube for precision application
• Electrical properties: non-conductive under normal conditions
• Thermal performance: formulated to improve heat transfer between chip and heatsink
• Compatibility: suitable for standard CPU and GPU surfaces and most heatsink base materials

How to use

Clean both chip and heatsink contact surfaces thoroughly with isopropyl alcohol and a lint-free cloth to remove old compound, dust, and oils. Apply a small, pea-sized amount of Akasa T6 ProGradePlus to the center of the chip or follow your component manufacturer's spreading recommendation. Install the heatsink and secure it according to the cooling solution's mounting instructions, allowing the compound to spread evenly under pressure. Avoid excessive amounts; a thin, continuous layer provides the best thermal interface.

Usage recommendations

Store the tube in a cool, dry place and reseal the cap after use to prevent drying. When reapplying thermal paste, inspect surface flatness and mounting hardware for proper contact; replace the paste if the system shows elevated temperatures or after removing the heatsink. Follow standard electrostatic discharge (ESD) precautions when handling processors and cooling components.