Heat-shrink tubing Alantec FOO-45, white, 4.5 cm

Alantec FOO-45 heat-shrink tubing is a short white sleeve designed for electrical insulation and mechanical protection of small wiring joints. With a 4.5 cm length and a 1.25 mm diameter before shrinking, this tubing is intended for covering solder joints, wire splices and small connectors in repair, prototyping and general wiring work. Supplied in a pack of multiple pieces, the tubing provides a compact, easy-to-use solution where a short protective sleeve is required.

Advantages

The tubing offers reliable electrical insulation and mechanical reinforcement for delicate connections without adding significant bulk. Its white color enables discreet coverage and easy visual identification, while the short 4.5 cm length makes it suitable for localized repairs and tidy wiring runs. The material shrinks uniformly when heated to form a tight, protective layer around conductors and joints.

Suitable for

• Covering soldered joints and wire splices
• Insulating small connectors and terminals
• Repairing consumer electronics and small appliances
• Prototyping and experimental wiring

Key specifications

• Type: heat-shrink tubing
• Color: white
• Length: 4.5 cm
• Nominal diameter before shrinking: 1.25 mm
• Quantity per pack: 100 pieces

How to use

Slide a suitably sized tube over the wire or joint before making the connection. After soldering or securing the splice, position the tubing so it fully covers the exposed area. Apply heat evenly using a heat gun, lighter or calibrated soldering tool until the tube contracts tightly around the conductor and forms a uniform seal. Allow the sleeve to cool before handling to ensure a secure fit.

Usage recommendations

Use appropriate heat sources and safety measures: keep the heat source moving to avoid overheating, maintain a safe distance to prevent damage to nearby components, and wear eye protection if required. Choose a tube diameter slightly larger than the conductor before shrinking to ensure proper fit, and verify insulation integrity after application.