Thermal Paste allied telesis Polartherm X-10, thermal compound, 10 g

Thermal paste allied telesis Polartherm X-10, thermal compound, 10 g is a thermally conductive compound supplied in a 10 g tube, designed to improve heat transfer between electronic components and heatsinks. The compound creates a thin, even interface layer that fills microscopic gaps and improves thermal conduction for CPUs, GPUs, power transistors and other heat-generating parts. Presented in a small cartridge, Polartherm X-10 is intended for electronics repair, cooling upgrades and routine maintenance of devices where efficient heat dissipation is required.

Advantages

Polartherm X-10 offers stable thermal conductivity and a consistent viscosity that facilitates even spreading and reduces the risk of air pockets at the interface. The non-volatile formulation limits drying and degradation over regular maintenance intervals, while the compact 10 g tube allows precise application in confined spaces and small repair jobs. The product is electrically non-conductive, minimizing the risk of short circuits when applied correctly to component surfaces.

Suitable for

• CPU and GPU thermal interface replacement or reapplication
• Power transistor and MOSFET cooling improvements
• Heatsink mounting during PC builds and repairs
• Cooling maintenance for networking and telecom equipment
• Small electronics repair and thermal troubleshooting

Key specifications

• Form: viscous thermal compound in a 10 g tube
• Application type: manual dispensing from cartridge
• Electrical properties: non-conductive (when used as directed)
• Intended use: interface between heat-generating components and heatsinks
• Compatibility: CPUs, GPUs, power transistors and similar components

How to use

Clean both component and heatsink contact surfaces with isopropyl alcohol and a lint-free cloth, removing old compound and contaminants. Apply a small, even amount of Polartherm X-10 to the center of the component surface and spread lightly if necessary, or allow pressure from the heatsink mounting to create an even thin layer. Reassemble the heatsink and secure it according to the device manufacturer's instructions. Avoid applying excess compound beyond the contact area to prevent overflow onto surrounding circuitry.

Usage recommendations

For reliable thermal performance, inspect the thermal paste during routine maintenance and replace when signs of dry-out or decreased heat transfer appear. Store the tube in a cool, dry place with the cap securely closed. Follow safety guidance for handling chemicals and ensure device power is disconnected before application.