Thermal pad Alphacool 12097 1 W/m·K 15x15x0.5 mm White

The Alphacool 12097 thermal pad is a double-sided adhesive thermal interface designed to mount heatsinks where conventional mounting is impractical. Supplied with protective film on both sides, the white pad measures 15 x 15 x 0.5 mm and offers a thermal conductivity of 1 W/m·K. The material is flexible and rubber-like, allowing good surface contact for reliable heat transfer while also providing strong mechanical adhesion.

Advantages

This Alphacool thermal pad combines thermal conduction with adhesive strength: it transfers heat with up to 1 W/m·K thermal conductivity while delivering a holding force of at least 16 N/25 mm. The pad adapts to uneven surfaces for improved contact and heat flow, is pre-cut to standard dimensions to reduce trimming, and tolerates mechanical stresses such as shocks or sustained pressure during transport or operation.

Suitable for

• Mounting small heatsinks on graphics cards and motherboards
• Situations where conventional mounting holes or brackets are unavailable
• Applications requiring both thermal transfer and permanent adhesive attachment

Key specifications

• Brand: Alphacool
• Model / MPN: 12097
• EAN: 4250197120975
• Thermal conductivity: 1 W/m·K
• Dimensions: 15 x 15 x 0.5 mm
• Color: White
• Adhesive holding power: ≥16 N/25 mm
• Format: Double-sided adhesive pad with protective film on both sides

How to use

Remove the protective film from one side and press the pad firmly onto the heatsink or target surface so it adheres evenly. Peel off the remaining protective film and position the heatsink onto the component, applying even pressure to ensure full contact. If a different size is required, trim the pad carefully with scissors or a knife before removing the final protective film. Ensure both surfaces are clean and dry for best adhesion and thermal contact.

Usage recommendations

Use the pad for permanent or semi-permanent heatsink mounting where mechanical brackets are not feasible. Avoid repositioning after full adhesion to prevent loss of adhesive strength. For critical high-power applications, verify thermal performance in your system configuration and consider additional cooling measures if needed.