Thermal pad Alphacool 12458

The Alphacool 12458 thermal pad is a grey, 100 mm x 100 mm heat transfer interface designed for use between heat-generating components and heatsinks or cooling plates. With a thickness of 0.5 mm, this single-pad pack provides a compliant layer that improves surface contact and reduces thermal resistance for electronics and cooling assemblies.

Advantages

The thermal pad combines a thin, uniform profile with sufficient pliability to fill microscopic surface irregularities while maintaining stable thermal performance. Its 0.5 mm thickness offers a consistent gap-filling capability that helps ensure efficient heat conduction. The pad's neutral grey colour and compact weight make it easy to position and handle during installation.

Suitable for

• Thermal interface between chips, MOSFETs, or power regulators and heatsinks
• Cooling plates and small radiators in PC or embedded systems
• Replacement or upgrade for existing thermal interface materials in electronics assemblies
• Applications requiring a 0.5 mm compliant thermal gap filler

Key specifications

• Dimensions: 100 mm × 100 mm
• Thickness: 0.5 mm
• Colour: Grey
• Package quantity: 1 pad
• Weight: 0.04 kg

How to use

Clean both mating surfaces to remove dust, grease, and old thermal material before application. Cut the thermal pad to the required shape and size if necessary, then peel any protective liners and place the pad on the component or heatsink, ensuring full coverage of the contact area. Apply moderate pressure to seat the pad and eliminate trapped air; when reassembling the device, secure the heatsink or cooling plate to achieve uniform contact. If removal is needed, lift the pad gently and clean surfaces again before reapplication.

Usage recommendations

Use this thermal pad where a 0.5 mm compliant interface is appropriate; avoid stretching the material when fitting. Store unused pads flat in a clean, dry environment away from direct sunlight and extreme temperatures to preserve performance.