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Heat Sink Compound Alphacool 1011305
Alphacool 1011305 heat sink compound is a grey thermal paste formulated to improve heat transfer between processors, graphics cards and cooling interfaces. Designed for general-purpose PC cooling tasks, this compound fills microscopic gaps between a heat source and a heatsink or cooler base to reduce thermal resistance and maintain stable operating temperatures. The paste's consistency supports straightforward application and rework when replacing cooling components.
The compound offers good thermal conductivity and a stable thermal interface layer that helps lower junction temperatures under load. Its grey formulation is non-conductive to the touch and resists drying out during normal operating conditions, which contributes to consistent thermal performance over time. The texture balances spreadability and staying power to avoid excessive migration while allowing thin, even coverage.
Clean surfaces before applying the compound using isopropyl alcohol and a lint-free cloth to remove old paste and contaminants. Apply a small, pea-sized amount to the centre of the processor heat spreader or follow the cooler manufacturer's recommended pattern. Mount the heatsink or cooler and secure it according to the mounting instructions to allow the compound to spread evenly under pressure. If reapplying, remove the old compound completely and repeat the cleaning and application steps.
For reliable results, use only a thin, even layer of Alphacool 1011305; avoid excessive amounts which can reduce thermal transfer efficiency. Allow the system to reach operating temperature and then verify cooler contact and thermals. Store the compound in a cool, dry place and keep the cap tightly closed when not in use.
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