Thermal pad Alphacool 12862 7 W/m·K Pink 120x20x1.5 mm

The Alphacool Eisschicht Light thermal pad (model 12862) is a 120 x 20 x 1.5 mm pink pad with a thermal conductivity of 7 W/m·K. Designed for electronic cooling applications, this semi-flexible, self-adhesive pad helps bridge gaps between chips and heatsink surfaces to improve heat transfer and stabilize component temperatures. It is supplied in a shape and size suited for RAM coolers and other compact cooling tasks and can be trimmed with scissors for a precise fit.

Advantages

The Alphacool Eisschicht Light combines moderate thermal conductivity with flexibility and self-adhesive properties, allowing easy mounting and reliable contact between components and coolers. Available in multiple thicknesses, it evens out height differences and conforms to irregular surfaces while remaining cuttable to custom dimensions. Its pink color and compact size make it suitable for visible or tight installations.

Suitable for

• RAM coolers and memory module cooling
• Graphics card VRM or chipset gap filling
• Motherboard heatsinks and small component cooling
• CPU cooler installation where small gaps exist

Key specifications

• Brand: Alphacool
• Model / MPN: 12862
• EAN: 4250197128629
• Thermal conductivity: 7 W/m·K
• Color: Pink
• Dimensions: 120 x 20 x 1.5 mm
• Material properties: elastic, self-adhesive, cuttable

How to use

Clean the contact surfaces to remove dust, oils, and old thermal interface material. Cut the thermal pad to the required shape using scissors. Peel off the protective film and place the pad so it covers the chip and aligns with the heatsink contact area. Apply even pressure to ensure full contact and adhesion. If necessary, use the available thickness options (0.5 mm, 1 mm, 1.5 mm) to achieve the correct gap filling and contact pressure.

Usage recommendations

Use the Alphacool Eisschicht Light on dry, dust-free surfaces and avoid stretching the pad when positioning. Replace the pad if it becomes damaged or loses adhesion. Select the thickness that provides firm but not excessive compression between component and heatsink for optimal thermal transfer.