Thermal pad Alphacool 12923 0.7 W/m·K White 26x30x0.5 mm

The Alphacool thermal pad with a thermal conductivity of 0.7 W/m·K is a compact thermal interface material designed for efficient heat transfer between electronic components and cooling solutions. Measuring 26 x 30 x 0.5 mm, this white pad provides a thin, conformable contact layer to reduce thermal resistance where space is limited. The single-piece pack allows straightforward replacement or upgrade of existing pads in small assemblies.

Advantages

This thermal pad delivers consistent thermal performance with a rated conductivity of 0.7 W/m·K, helping to improve heat dissipation from chips, power components, or other heat-generating zones. Its 0.5 mm thickness balances gap filling and thermal efficiency while remaining thin enough for tight tolerances. The white color gives a neutral appearance that is easy to position and inspect during installation. The pad’s dimensions are suited to targeted cooling tasks without unnecessary oversizing.

Suitable for

• Thermal interface between small ICs or power transistors and heatsinks or spreaders
• Filling thin gaps in compact motherboards, single-board computers, or embedded systems
• Replacing worn or degraded pads in cooling modules of networking equipment or small form-factor PCs
• Point cooling for LED modules, VRM areas, or other localized hotspots

Key specifications

• Thermal conductivity: 0.7 W/m·K
• Dimensions (W × D × H): 26 × 30 × 0.5 mm
• Color: white
• Form factor: single thin sheet, conformable pad

How to use

Clean both contact surfaces to remove dust, oils, and old thermal material. Cut the pad to the required shape if necessary, ensuring full coverage of the component without overhang that could compress adjacent parts. Place the pad onto the component or heatsink, align the mating surface, and assemble the parts with even pressure to ensure uniform contact. Verify that the pad sits flat and that the assembled clearance matches the pad thickness to avoid excessive compression or gaps.

Usage recommendations

Store the thermal pad in a dry, dust-free environment away from direct sunlight. For best thermal results, avoid compressing the pad beyond its intended thickness; replace the pad if it becomes torn, contaminated, or permanently deformed. Use in applications where a 0.5 mm gap filler with 0.7 W/m·K conductivity is appropriate.