Thermal pad Alphacool Ultra Soft 100x100x1mm White

The Alphacool Ultra Soft 100x100x1mm White thermal pad is a soft, conformable interface material designed to improve heat transfer between electronic components and heatsinks. With a 1 mm thickness and a 100 x 100 mm footprint, this thermal pad fills microscopic gaps and surface irregularities to promote consistent thermal contact and reduce thermal resistance in cooling assemblies.

Advantages

The Ultra Soft material provides high conformity to uneven surfaces while maintaining mechanical stability during installation and operation. Its white color and uniform thickness make alignment and trimming simple when fitting into cooling layouts. The pad is engineered to offer reliable thermal conductivity across a range of operating temperatures, helping maintain component temperatures within desired limits without the need for liquid or adhesive-based solutions.

Suitable for

• Thermal interface between chips, power components and heatsinks
• Gap filling in computer cooling assemblies and electronics enclosures
• Replacement or upgrade of existing pads in small-form cooling projects
• Applications requiring non-liquid, non-curing thermal interfaces

Key specifications

• Type: Thermal pad
• Color: White
• Dimensions: 100 x 100 x 1 mm (length x width x thickness)
• Material property: Ultra soft, conformable
• Function: Fills gaps and improves thermal contact between surfaces

How to use

Clean both mating surfaces to remove dust, grease and old thermal material. Measure and trim the thermal pad to match the component or heatsink footprint if necessary, using a sharp blade or scissors. Place the pad between the component and heatsink, ensuring full coverage of the contact area. Assemble the cooling parts and apply even pressure to seat the pad; avoid excessive compression beyond the recommended thickness to maintain thermal performance.

Usage recommendations

Store the thermal pad in a dry, dust-free environment and avoid prolonged exposure to direct sunlight. For best results, inspect the interface periodically and replace the pad if it becomes deformed or contaminated. Use this pad where a soft, non-curing thermal interface is required and ensure the thickness matches the gap to be filled for optimal thermal transfer.