Thermal adhesive Alphacool 13004 0.9 W/m·K 5 g

Alphacool 2-part thermal adhesive (5 g, MPN 13004) is an epoxy-based paste designed to bond heatsinks and coolers to electronic components where a secure, thermally conductive connection is required. With a thermal conductivity of 0.9 W/m·K and high aluminium nitride content, it is suitable for attaching coolers to VRMs, CPUs and GPUs on single-board computers (Raspberry Pi, ODROID, Arduino, Cubieboard), as well as for use on power amplifier electronics or RC vehicle components.

Advantages

The adhesive is electrically non-conductive and contains 70–73% aluminium nitride to provide good thermal conduction. It forms a stable mechanical bond that can accommodate small differences in component surfaces. Surface cure begins after approximately 2 hours at 25°C, with full cure achieved within 5–7 days under the same temperature conditions.

Suitable for

• Mounting heatsinks to VRMs on motherboards
• Bonding coolers to CPUs and GPUs on single-board computers
• Attaching heatsinks or cooling elements in power amplifiers
• Securing coolers and thermal pads in RC vehicles and other electronic assemblies

Key specifications

• Brand: Alphacool
• MPN: 13004
• EAN: 4250197130042
• Net weight: 5 g
• Thermal conductivity: 0.9 W/m·K
• Composition: epoxy-based, 70–73% aluminium nitride
• Electrical property: non-conductive
• Surface cure time: ~2 hours (at 25°C)
• Full cure time: 5–7 days (at 25°C)

How to use

Ensure all bonding surfaces are clean and free from grease, dust, or other contaminants. The adhesive comes in two components (adhesive = black, applicator = yellow) and must be mixed thoroughly on a clean surface in a 4:1 ratio. Mix with a spatula for about 2–3 minutes until homogeneous. The processing time is limited—typically around 10 minutes before initial curing starts—so apply the mixed adhesive thinly and evenly to the surfaces to be bonded and press the components together. Higher ambient temperatures during application accelerate curing and improve high-temperature strength.

Usage recommendations

Mix thoroughly in the correct 4:1 ratio and work within the ~10-minute processing window. Allow at least 2 hours for surface curing and 5–7 days for full cure at 25°C; avoid mechanical stress or thermal cycling until fully cured.