Thermal pad Alphacool 13013 7 W/m·K Grey 50x50x3 mm

The Alphacool 13013 thermal pad is a grey, soft thermal interface material engineered to improve heat transfer between electronic components and cooling solutions. With a thermal conductivity of 7 W/m·K and dimensions of 50 x 50 x 3 mm, this pad fills microscopic gaps and surface irregularities to reduce thermal resistance and support stable operating temperatures for a variety of devices.

Advantages

This thermal pad provides a high thermal conductivity of 7 W/m·K to efficiently conduct heat from chips and modules to heatsinks or cold plates. Its 3 mm thickness enables compensation for uneven surfaces and larger gaps without compressing excessively, while the 50 x 50 mm size suits medium-sized components. The grey material is flexible and conforms to mating surfaces, offering reliable long-term contact and consistent thermal performance under normal operating conditions.

Suitable for

• Thermal bridging between power ICs, MOSFETs and heatsinks
• Cooling interfaces in small to medium-size PCBs and modules
• Heatsink contact on voltage regulators and memory modules
• Thermal conduction in compact electronics and embedded systems

Key specifications

• Thermal conductivity: 7 W/m·K
• Color: grey
• Dimensions: 50 x 50 x 3 mm (length x width x thickness)
• Material form: soft, conformable thermal pad

How to use

Clean both mating surfaces to remove dust, grease and old thermal compounds before application. Cut the thermal pad to the required shape if necessary, ensuring full coverage of the heat source without overhang that could contact other components. Peel protective films if present and place the pad between the component and heatsink, then apply even pressure to seat the pad and establish good contact. Reassemble the device and verify that mechanical mounting provides consistent compression across the pad.

Usage recommendations

Use the thermal pad in applications where a 3 mm thickness is needed to bridge gaps or compensate for uneven surfaces. Avoid placing the pad in locations with constant mechanical abrasion or where conductive contaminants could cause electrical shorts. For optimal thermal performance, ensure firm, even compression and monitor operating temperatures after initial installation.