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Thermal pad Alphacool Core 6.2 W/m·K 100x100x1.5 mm
Alphacool Core thermal pad with a thermal conductivity of 6.2 W/m·K and dimensions 100 x 100 x 1.5 mm is a silicone-based heat-conductive pad designed to improve heat dissipation from electronic components. With a density of 3.1 g/cm³ and a formulation that reduces silicone bleeding, this pad provides stable thermal performance and a longer service life compared with conventional pads. Its electrical insulation makes it suitable for use where electrical isolation is required.
The Core thermal pad combines low hardness and natural tackiness to conform to uneven surfaces and fill gaps between components, enabling improved heat transfer. Its special material composition reduces the risk of silicone bleeding, allowing longer use without significant loss of thermal performance. Being electrically non-conductive, it can be applied safely near sensitive circuitry.
Cut the pad to the required shape and size to match the component surfaces. Clean both contact surfaces from dust, grease and old thermal material before application. Place the Alphacool Core thermal pad between the heat source and the heatsink or contact plate, ensuring full contact and avoiding twists or folds. Reassemble the device and verify correct pressure distribution to maintain good thermal contact.
For best results, select a pad thickness that compensates for unevenness between components without causing excessive compression. Inspect the pad periodically for mechanical damage or contamination and replace it if thermal performance degrades. Avoid contact with sharp edges during installation to prevent tearing.
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