Thermal pad Alphacool Core 6.2 W/m·K 40x40x0.5 mm

Alphacool Core thermal pad (6.2 W/m·K) is a silicone-based thermal interface material sized 40x40x0.5 mm, designed to improve heat transfer between electronic components and heatsinks. With a thermal conductivity of 6.2 W/m·K and a density of 3.1 g/cm³, this pad is suitable for dissipating waste heat from voltage regulators, VRAM on graphics cards, and components in game consoles, helping to maintain stable operation and prolong component life.

Advantages

The soft, silicone-based composition provides optimal compressibility and natural adhesion, allowing the pad to conform to uneven surfaces and reduce thermal resistance. Compared with standard thermal pads, the Core pad offers improved contact and heat transfer. Its special material formulation reduces the risk of silicone bleeding, enabling a longer usable lifetime without significant loss of performance. The pad is electrically non-conductive, expanding its applicability across various electronic devices.

Suitable for

• Voltage converters and VRAM on graphics cards
• Electronic components in Playstation and Xbox consoles
• Motherboards, power supplies and servers
• Memory modules and access points
• Mobile devices, LCD TVs and notebooks

Key specifications

• Brand: Alphacool
• Model: Core thermal pad
• Thermal conductivity: 6.2 W/m·K
• Density: 3.1 g/cm³
• Dimensions: 40 x 40 x 0.5 mm
• MPN: 13407
• EAN: 4250197134071
• Electrical insulation: electrically non-conductive

How to use

Clean both contact surfaces thoroughly to remove dust, old thermal material and oils. Cut the Alphacool Core pad to the required size if necessary, remove protective films, and place it between the component and the heatsink, ensuring full coverage of the contact area. Apply even mounting pressure so the pad compresses and fills surface irregularities. Recheck alignment before final assembly and avoid stretching or tearing the pad during installation.

Usage recommendations

Use the pad in applications where electrical insulation is required. Replace the thermal pad if physical damage or persistent performance degradation is observed. For optimal results, confirm compatible thickness and compression with your specific hardware and mounting method.