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Thermal pad Alphacool Core 6.2 W/m·K 40x40x1mm
Alphacool Core thermal pad (40x40x1mm, 6.2 W/m·K) is a silicone-based thermal interface material designed to improve heat transfer between electronic components and heatsinks. With a thermal conductivity of 6.2 W/m·K and a density of 3.1 g/cm³, this pad fills gaps and compensates for surface unevenness to reduce thermal resistance in devices such as graphics cards, game consoles and other electronic equipment.
The soft, compressible silicone composition provides low hardness and natural tackiness, allowing the pad to conform to irregular surfaces and improve contact between components and cooling elements. Its material formulation reduces the risk of silicone bleeding, offering a longer usable life compared with many conventional thermal pads. The pad is electrically non-conductive, enabling safe use near sensitive circuitry.
Cut the thermal pad to the required size if necessary, then place it between the heat-generating component and the heatsink or cold plate. Apply even pressure to compress the pad and remove air gaps, ensuring full surface contact. Reassemble the device according to the manufacturer's instructions. Replace the pad if it shows visible wear or reduced compressibility.
Store the thermal pad in a cool, dry place and avoid exposure to solvents or sharp objects. For best thermal performance, ensure mating surfaces are clean and free of dust or old thermal interface residues before applying the pad.
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