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Thermal pad Alphacool Core 9 W/m·K 100x100x1.5 mm
The Alphacool Core thermal pad (100 x 100 x 1.5 mm) is a silicone-based heat conduction pad with a thermal conductivity of 9 W/m·K and a density of 3.2 g/cm³. It is designed to improve heat dissipation from electronic components such as VRAM and voltage regulators on graphics cards, game console electronics, motherboards, power supplies and other devices where efficient thermal transfer is required.
The soft silicone formulation provides low hardness and natural tackiness, allowing the pad to conform to uneven surfaces and fill gaps for improved thermal contact. Its special material composition reduces the risk of silicone bleeding, which extends usable life compared with many conventional thermal pads. The pad is electrically non-conductive, enabling safe use near sensitive electronic circuits.
Clean and dry both surfaces before applying the thermal pad. Cut the pad to the required size if necessary, remove any protective film, and place it between the heat-generating component and the heatsink or casing to ensure full contact. Apply even, moderate pressure when assembling the device so the pad compresses and fills surface irregularities. Verify proper clearance and secure mounting according to the device manufacturer's instructions.
Use the Alphacool Core thermal pad where electrical insulation is required and moderate compression is possible. Avoid excessive mechanical shear during installation and replace the pad if it shows visible damage or reduced thickness to maintain optimal thermal performance.
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