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Thermal pad Alphacool Core 9 W/m·K 40x40x2 mm
The Alphacool Core thermal pad (40x40x2 mm, 9 W/m·K) is a silicone-based thermal interface material designed to improve heat dissipation in electronic components. With a thermal conductivity of 9 W/m·K and a density of 3.2 g/cm³, the pad bridges gaps between heat-generating parts and heatsinks to maintain stable operating temperatures in devices such as graphics cards, game consoles and other electronic equipment.
The Soft heat conduction pad offers low hardness and natural tackiness, allowing it to conform to uneven surfaces and compensate for component tolerances. This optimal compressibility improves thermal transfer compared to many standard thermal pads. Its special material composition reduces the risk of silicone bleeding, resulting in a longer usable service life without significant loss of performance. The pad is electrically non-conductive, enabling safe use near sensitive circuitry.
Clean both contact surfaces to remove dust, grease and old thermal material. Cut the Alphacool Core thermal pad to the required shape and size if necessary, then place it between the heat source and the heatsink, ensuring full contact with both surfaces. Apply even pressure when reassembling the device so the pad compresses and fills gap irregularities. Do not stretch the pad when fitting and avoid folding or contaminating the contact faces.
For reliable performance, check the pad periodically for physical damage or compression over long-term use and replace if thermal performance degrades. Avoid contact with sharp edges and solvents; store the pad flat in a dry environment away from direct sunlight.
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