Thermal pad Alphacool 13455 3 W/m·K White 100x100x1.5 mm

The Alphacool thermal pad with a thermal conductivity of 3 W/m·K is a soft, conformable interface material designed to improve heat transfer between electronic components and heatsinks or cooling plates. Measuring 100 x 100 x 1.5 mm, the white pad fills microscopic gaps and irregularities on mating surfaces to reduce thermal resistance and support stable operating temperatures in compact cooling assemblies.

Advantages

This thermal pad offers a balance of thermal performance and ease of use, combining a medium-high thermal conductivity with pliable mechanical properties that simplify installation on uneven surfaces. Its 1.5 mm thickness provides sufficient compensation for moderate gaps while maintaining good contact pressure. The neutral white color is unobtrusive in system builds and helps visual alignment during placement.

Suitable for (tasks / use cases)

• Filling gaps between CPUs, GPUs or power components and heatsinks in desktop or small-form-factor systems
• Thermal bridging for VRMs, MOSFETs and other power-regulation modules on motherboards
• Interface material for cooling plates, waterblock contact surfaces and passive cooling assemblies
• Prototyping and repair tasks where a reusable, conformable thermal interface is needed

Key specifications

• Thermal conductivity: 3 W/m·K
• Dimensions: 100 x 100 x 1.5 mm
• Color: white
• Material form: compressible thermal pad
• Typical use: thermal interface for electronic components and heatsinks

How to use

Clean both contact surfaces of dust, old thermal material and oils before placing the pad. Cut the pad to the required shape and size if necessary, then position it so it covers the component contact area evenly. Apply the heatsink or cooling plate with even pressure to compress the pad and create full surface contact. Avoid stretching the pad; if repositioning is needed, lift gently and realign.

Usage recommendations

For reliable thermal performance, ensure mating surfaces are flat and free of debris and select a pad thickness that matches the gap to be filled. Do not use in direct, prolonged exposure to liquids or open flames. For critical high-power applications, verify thermal performance under load and consider mechanical fixation to maintain consistent pressure.