Thermal pad Alphacool Core 1 W/m·K 100x100x0.25 mm

Alphacool Core double-sided adhesive thermal pad transfers heat away from electronic components where effective dissipation of waste heat is required. With a thermal conductivity of 1 W/m·K and a thickness of 0.25 mm, the pad supports improved performance and longer component lifetime while simplifying assembly thanks to its tacky surface.

Advantages

The Alphacool Core thermal pad combines flexibility and reliable thermal performance in a thin format. Its material composition and density of 1.2 g/cm³ provide stable thermal transfer, and the adhesive surfaces allow straightforward placement and fixation of components without additional fasteners. The pad can be cut to size for custom applications and accommodates low-profile gaps between heat sources and sinks.

Suitable for

• DDR memory modules and heatsinks
• Motherboard components (VRMs, MOSFETs, chipset)
• Power supplies and DC‑DC converters
• Small electronics and PCB hot spots

Key specifications

• Brand: Alphacool
• Model / MPN: 13523
• EAN: 4250197135238
• Thermal conductivity: 1 W/m·K
• Dimensions: 100 x 100 x 0.25 mm
• Density: 1.2 g/cm³
• Double-sided adhesive

How to use

Clean and dry both mating surfaces to remove dust, oils or old thermal interface material. Cut the Alphacool Core pad to the required shape and size using scissors or a sharp blade. Remove one liner and press the adhesive side onto the heat source, align the component, then remove the second liner and press the component firmly to ensure full contact. Ensure there is no excessive compression beyond the intended gap thickness.

Usage recommendations

Use the pad where thin, conformable thermal interfaces are needed and where a semi-permanent adhesive bond is acceptable. Avoid using on surfaces that require frequent removal of components; for repeated disassembly consider non-adhesive thermal pads or thermal paste. Store the pad flat and protected from dust and direct sunlight to maintain adhesive properties.