Thermal Paste Aqirys AQ-6 High Performance Low Thermal Resistance, 3–5 g syringe equivalent

Aqirys AQ-6 High Performance Low Thermal Resistance thermal paste is formulated to improve heat transfer between processors and heatsinks in desktop PCs, workstations and gaming systems. Supplied in a syringe-style applicator equivalent to 3–5 g, the compound is designed for precise application to CPUs, GPUs and other electronic components where efficient thermal conduction is required. The material’s low thermal resistance supports stable cooling and can help lower operating temperatures when applied correctly.

Advantages

The AQ-6 compound delivers consistent thermal conductivity with low thermal resistance to reduce temperature differences between chip surfaces and cooling solutions. The syringe-style dispenser allows controlled, accurate application to small or irregular surfaces, minimising excess material and ensuring even coverage. The non-curing formulation maintains its properties over time and is compatible with common heatsink mounting pressures and surface finishes used in consumer and enthusiast systems.

Suitable for

• CPU and socketed processors in desktop computers and workstations
• Discrete GPUs and graphics cards requiring direct-die or IHS contact improvement
• Cooling of chipsets, VRMs and other heat-generating electronic components
• Custom cooling loops and aftermarket heatsinks in gaming rigs and enthusiast builds

Key specifications

• Form: paste/compound in syringe-style applicator (3–5 g equivalent)
• Thermal characteristic: formulated for low thermal resistance and improved heat transfer
• Compatibility: suitable for metal and ceramic contact surfaces used in CPUs, GPUs and heatsinks
• Application viscosity: designed for controlled spread and even coverage under mounting pressure
• Stability: non-curing formulation intended for long-term thermal performance

How to use

Clean both the processor surface and heatsink contact area with isopropyl alcohol and a lint-free cloth before applying the paste. Dispense a small, pea-sized amount from the syringe onto the centre of the chip or use a thin line for elongated dies. Mount the heatsink and secure it according to the manufacturer’s instructions so the paste spreads evenly under pressure; avoid re-positioning the heatsink repeatedly once contact has been made. Remove any excess material from the edges after installation if necessary.

Usage recommendations

Use sparingly to achieve a thin, even thermal interface layer; excessive quantity does not improve thermal transfer. Allow for proper airflow and adequate mounting pressure for optimal results. Replace the thermal paste during major maintenance or when temperatures increase noticeably compared with baseline performance.