Thermal pad ARCTIC TP-3 Premium Performance 100 x 100 mm 1 mm

Ensure the lowest thermal resistance with the award-winning MX thermal compound and complementary thermal pads. The high-performance MX thermal grease is recognized for consistent quality and strong results in performance comparisons. It achieves very low thermal resistance through a minimal bond line thickness and is supplied together with a selection of thermal pads in various designs and sizes to meet different cooling needs.

Advantages

The MX thermal compound provides exceptionally low thermal resistance thanks to its thin, uniform layer after application. It is formulated for reliable heat transfer, easy to spread and suitable for users of all skill levels. Thermal pads expand compatibility to components where paste is impractical, offering clean, repeatable installation options in multiple sizes and thicknesses.

Key specifications

• Type: high-performance thermal compound (MX) and thermal pads
• Performance: very low thermal resistance
• Application thickness: minimum bond line thickness for paste
• Compatibility: CPUs, GPUs, chipsets and other electronic components where thermal interfaces are required
• Availability: thermal pads in various designs and sizes

How to use

Apply a small, controlled amount of MX thermal compound to the heat source and spread or allow the heatsink pressure to create a thin uniform layer; follow the manufacturer’s guidelines for exact quantity. For components where paste is unsuitable, select an appropriately sized thermal pad and place it between surfaces, ensuring full contact and proper alignment. Clean mating surfaces before applying any thermal interface and reapply when replacing or servicing components.

Recommendations

Use paste for direct chip-to-heatsink interfaces where minimal thermal resistance is critical; use thermal pads for irregular gaps or components requiring non-messy, repeatable replacements. Store thermal materials at recommended temperatures and replace them if damaged or contaminated.