Arctic TP-4 Premium Performance Thermal Pad with Grey density 3.4 g/cm³ and 0.5 mm thickness

The Arctic TP-4 Premium Performance Thermal Pad is designed for efficient heat dissipation in computer components and cooling systems. Featuring a grey color and a density of 3.4 g/cm³, this silicone-based pad combines high thermal conductivity with extremely low hardness to reliably compensate for manufacturing tolerances between chips. Supplied in a 4-pack configuration with dimensions of 120 x 20 mm and a thickness of 0.5 mm, it is engineered to improve thermal transfer between processors, graphics cards, and heatsinks.

Advantages

The thermal pad offers extremely soft material properties that allow it to be compressed by up to 60 percent depending on mounting pressure, thereby minimizing thermal resistance. It adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact and efficient heat dissipation. Being electrically insulating and non-adhesive, it provides safe application and straightforward handling. Furthermore, the material is versatile, vibration-dampening, and can be easily cut to size, while also supporting stackable configurations without performance loss.

Suitable for

• Improving heat transfer on graphics cards and GPUs
• Cooling computer processors and chipsets
• Thermal management in laptops and gaming consoles
• Application on RAM and various electronic components

This product may not be suitable if the required gap between the component and the heatsink is significantly larger or smaller than the 0.5 mm thickness provided, as incorrect thickness selection can lead to improper contact or excessive mounting pressure. It is also not intended to replace liquid thermal paste in applications where paste is specifically mandated by the hardware manufacturer.

Key specifications

• Thermal pad type
• Density of 3.4 g/cm³
• Grey color
• Thickness of 0.5 mm
• Width of 20 mm
• Depth of 120 mm
• Quantity of 4 pieces per pack
• Silicone-based material
• Electrically insulating

To use the thermal pad, first clean the surfaces of the electronic components and heatsinks thoroughly to remove any old paste, dust, or residue. Measure the required area on the chip and cut the pad to the appropriate size using scissors or a blade if necessary. Remove any protective layers, carefully place the pad onto the target component, and install the heatsink applying even mounting pressure to ensure proper compression and optimal thermal contact.

What to consider before purchase

• Verify the required thickness for your specific hardware component
• Check the dimensions to ensure the pad matches the surface area of the chip
• Confirm that an electrically insulating, non-adhesive pad meets your installation requirements

Usage recommendations: Ensure all contact surfaces are completely clean and free of grease before application. Do not exceed recommended compression limits to maintain structural integrity and effective thermal transfer across the components.