Thermal Pad Arctic TP-4 Grey 3.4 g/cm³

The Arctic TP-4 Grey 3.4 g/cm³ is a premium performance thermal pad designed to provide efficient heat transfer and cooling for computer hardware, graphics cards, and various electronic components. This thermal interface material helps manage temperatures in demanding setups by bridging uneven surfaces and minimizing thermal resistance. Each pack contains 4 pieces with a density of 3.4 g/cm³, ensuring reliable thermal management across your devices.

Advantages

The Arctic TP-4 Grey 3.4 g/cm³ features a silicone-based composition that combines high thermal conductivity with extremely low hardness, allowing it to reliably compensate for manufacturing tolerances between chips. It is electrically insulating, non-adhesive, and easy to handle for safe application. Due to its soft structure, the pad can be compressed up to 60% of its original thickness under mounting pressure, adapting optimally to varying chip heights and air gaps. It can also be cut individually to size and stacked without performance loss, making it highly flexible for different hardware configurations.

Suitable for

• Cooling computer hardware components and graphics cards
• Managing temperatures on RAM and chipsets
• Application in laptops and gaming consoles
• Bridging air gaps and uneven surfaces on electronic components

When it may not be suitable

This thermal pad may not be suitable for applications requiring a liquid thermal paste or where a permanent adhesive bond is necessary between the component and the heatsink. It is also important to ensure the required gap thickness matches the 1 mm dimension of the pad.

Key specifications

• Type: Thermal pad
• Density: 3.4 g/cm³
• Colour: Grey
• Dimensions per piece: 20 mm width, 120 mm depth, 1 mm height
• Quantity: 4 pieces per pack
• Electrically insulating and non-adhesive

How to use

Before application, ensure the surfaces of the electronic components and the heatsink are clean, dry, and free of dust or old thermal material. Measure the required area on your component and cut the thermal pad to the appropriate size using scissors if necessary. Remove any protective layers and place the pad carefully onto the target chip or surface. Press the heatsink firmly into place to allow the pad to adapt to uneven surfaces and bridge air gaps effectively.

What to consider before purchase

• Verify that the 1 mm thickness matches the gap between your component and the cooling solution
• Check the required dimensions to ensure the 20 x 120 mm size fits your application
• Confirm that a non-adhesive thermal pad meets the installation requirements of your hardware

Usage recommendations

For optimal cooling performance, ensure even mounting pressure is applied across the component so the pad can compress correctly and maintain maximum thermal contact. Avoid reusing old pads if components are disassembled.