Arctic TP-4 Premium Performance Thermal Pad, Grey, Density 3.4 g/cm³, 4-pack

The Arctic TP-4 Premium Performance Thermal Pad is a high-quality heat-conducting solution designed to facilitate efficient heat transfer between various computer components and coolers. Featuring a density of 3.4 g/cm³ and a soft, silicone-based composition, this grey thermal pad is engineered to improve thermal management and prevent overheating in electronic devices during intensive workloads. This convenient 4-pack provides sufficient material for multiple components or applications, ensuring reliable cooling performance across your hardware setup.

Advantages

The Arctic TP-4 thermal pad combines high thermal conductivity with an extremely low hardness level, which allows it to reliably compensate for manufacturing tolerances and uneven surfaces between chips and heatsinks. Its electrically insulating and non-adhesive properties ensure safe application without the risk of short circuits. Furthermore, the material can be compressed by up to 60 percent depending on mounting pressure to minimize thermal resistance, and it can be easily cut to size to fit specific components.

Suitable for

• RAM modules and memory chips
• Computer chipsets and motherboards
• Graphics processing units and video cards
• Gaming consoles and laptops

When it may not be suitable

This product may not be suitable for applications requiring traditional thermal paste where pad thickness interferes with proper cooler mounting. It is also not recommended for extreme sub-zero overclocking setups that demand specialized phase-change materials or liquid metal.

Key specifications

• Thermal pad type
• Density of 3.4 g/cm³
• Grey colour
• Dimensions of 20 mm width, 120 mm depth, and 1.5 mm height
• Quantity of 4 pieces per pack
• Operating temperature range from -40 °C to 200 °C

How to use

Before applying the Arctic TP-4 thermal pad, ensure that the contact surfaces of the component and the cooler are completely clean, dry, and free of dust or old thermal interface material residue. Measure the required dimensions of the component and cut the thermal pad to the appropriate size using scissors if necessary. Remove the protective film from both sides of the pad, carefully place it onto the target chip, and press the cooler firmly on top to secure proper contact and heat transfer.

What to consider before purchase

• Verify the required thickness for your specific hardware components to ensure correct cooler mounting pressure.
• Check the dimensions of the components to confirm that the pad size and quantity in the 4-pack are sufficient.
• Ensure that the application area is clean and compatible with silicone-based thermal pads.

To achieve optimal thermal performance, ensure correct thickness selection and firm mounting pressure so the pad can effectively compress and bridge any air gaps between the component and the cooler.