Thermal paste arctic silver MATRIX thixotropic premium C 3.5 g

Thermal Matrix Thixotropic Premium Thermal Compound (Arctic Silver MATRIX) is a high-performance thermal grease designed to improve heat transfer between modern high-power CPUs, GPUs and high-performance heatsinks or water-cooling solutions. Supplied in a 3.5 g syringe, the compound combines micronized zinc oxide, aluminum oxide and aluminum particles suspended in a silicone oil to form a thermally conductive matrix that delivers stable, long-term thermal contact in moderate to large bond line applications.

Advantages

The unique thermal matrix and silicone suspension provide excellent surface wetting and easy application, enabling the compound to fill microscopic voids and valleys between mating surfaces. MATRIX is formulated to be an electrical insulator and offers lower full-load CPU core temperatures (typically 2–12 °C lower versus standard thermal compounds or pads when measured at the hottest CPU core diode) after break-in. The product is RoHS compliant and intended for demanding thermal interfaces where long-term stability is required.

Suitable for

• High-power desktop CPUs and GPUs
• High-performance air and water cooling heatsinks
• Systems requiring durable thermal interface material for moderate to large bond lines
• Small electronic components where precise thermal conduction is needed

Key specifications

• Brand: Arctic Silver (MATRIX)
• Available in: 3.5 g syringe
• Average particle size: 7.8 microns
• Temperature limits (peak): –50 °C to 135 °C
• Coverage: ~1 cc (3.5 g syringe). At 0.003" layer thickness a 2.5 g syringe covers ≈ 20 in² (coverage proportional)
• Electrical properties: electrically insulating
• RoHS compliant: Yes

How to use

Clean both mating surfaces thoroughly of old thermal material and contaminants. Apply a small, even amount of MATRIX thermal compound to the CPU or GPU heat spreader and mount the heatsink according to the heatsink manufacturer’s instructions, ensuring even pressure and proper alignment. Operate the system under normal conditions; the carrier fluid and particle matrix require a break-in period of thermal cycling and time to reach maximum particle-to-particle conduction. During the first several hundred hours of use the interface will gradually improve as the compound fills microscopic gaps.

Usage recommendations

Allow a minimum break-in period of about 300 hours with multiple thermal cycles (longer if the heatsink has no fan) for maximum thermal conductivity. The product is not electrically conductive; follow standard application precautions to avoid excess squeezing of compound onto motherboard components. Store the syringe in a cool, dry place when not in use.