Heatsink/Radiator Dynatron T318 Copper 106mm x 82mm x 27mm

The Dynatron T318 Copper heatsink measures 106mm x 82mm x 27mm and is engineered to provide effective passive heat dissipation for compact computer cooling solutions. Constructed from copper to maximize thermal conductivity, the heatsink is intended for use on processors or other heat-generating components where a low-profile, high-conductivity solution is required. Its compact footprint and solid copper body promote rapid heat transfer away from the component, helping to maintain stable operating temperatures under typical system loads.

Advantages

The copper construction offers superior thermal conductivity compared with aluminium alternatives, enabling faster heat spread and improved temperature control. The low-profile dimensions (106 × 82 × 27 mm) make the unit suitable for systems with limited vertical clearance. The solid design ensures reliable contact with the component base and supports passive or active cooling configurations when paired with an appropriate fan or airflow path.

Suitable for

• Small form factor desktop PCs and HTPC enclosures
• Embedded systems and industrial motherboards with restricted height
• Cooling single-board computers or low- to mid-power CPUs
• Upgrading OEM passive cooling on compact systems

Key specifications

• Material: Copper for high thermal conductivity
• Dimensions: 106 mm (width) × 82 mm (depth) × 27 mm (height)
• Design: Low-profile solid-block heatsink suitable for direct contact mounting
• Mounting interface: Designed for close-contact attachment to processors or chips (ensure compatibility with mounting hardware and socket spacing)
• Use mode: Intended for passive cooling or combined with forced airflow for enhanced performance

How to use

Before installation, power down the system and disconnect from mains. Clean the processor or component surface and the heatsink contact face to remove old thermal compound, dust, or debris. Apply a thin, even layer of thermal interface material to the component heatspreader, then position the Dynatron T318 so the contact surface aligns with the component. Secure the heatsink using appropriate mounting hardware that matches the board layout and socket clearance, taking care not to overtighten fasteners. If additional cooling is required, arrange chassis airflow or install a low-profile fan to direct air across the heatsink fins.

Usage recommendations

Use a high-quality thermal paste and verify mechanical compatibility with your motherboard and case. For systems with limited airflow, pair the heatsink with directed fan airflow to maintain lower junction temperatures. Periodically inspect the contact area and clean any dust build-up to preserve thermal performance.