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Heatsink/Radiator Dynatron Q1 — Copper, 90×90×27 mm, for LGA 1700, 130 W TDP
Summary description:
Dynatron Q1 is a compact copper heatsink/radiator sized 90×90×27 mm designed for passive cooling of processors on LGA 1700 sockets. With a rated TDP of 130 W and a weight of 0.49 kg, it suits low-profile or 1U systems where space and thermal performance are constrained. Typical uses include small-form-factor servers, embedded systems and compact workstations requiring reliable passive heat dissipation.