Thermal paste ENDORFY Pactum 4 12 W/m·K 1.5 g

Pactum 4 1.5 g thermal paste provides a thin, thermally conductive interface between a processor and its cooler. The 1.5 g syringe contains a non-curing compound designed to improve heat transfer from the CPU surface to the cooling solution, helping maintain lower operating temperatures during use.

Advantages

Pactum 4 applies smoothly and spreads easily with the included spatula, allowing quick and accurate coverage. The small 1.5 g amount is suitable for single installations or for users who perform occasional CPU maintenance. The compound remains pliable and does not harden, ensuring consistent thermal contact after installation.

Key specifications

• Product name: Pactum 4
• Net weight: 1.5 g
• Type: thermal paste (non-curing)
• Application: CPU to cooler thermal interface
• Included accessory: spatula for spreading

How to use

Clean the CPU heat spreader and the cooler contact plate from old paste and contaminants. Apply a thin layer of Pactum 4 across the processor surface using the supplied spatula to achieve a uniform film. Mount the cooler according to its instructions, ensuring even pressure to spread the paste and create optimal contact.

Recommendations

Use a small, even amount of Pactum 4 for each installation; the 1.5 g syringe is intended for a few applications depending on CPU size. Store the paste in a cool, dry place and reseal the syringe after use to preserve consistency.