Thermal pad Gelid 7 W/mK 120×20×1 mm – heat-conductive pad for cooling components

Gelid 7 W/mK thermal pad, sized 120×20×1 mm, is a heat-conductive interface material designed to improve thermal transfer between electronic components and heatsinks. The pad fills microscopic and larger surface irregularities to reduce thermal resistance and improve the efficiency of cooling solutions in PC and industrial equipment. Its solid, conformable form provides a consistent thermal path for CPUs, GPUs, power modules, LED assemblies and other heat-generating components that require stable, low-resistance contact with heatsinks or metal chassis.

Advantages

The Gelid thermal pad offers a thermal conductivity of 7 W/mK, enabling effective heat flow from components to cooling surfaces without the need for liquid or paste application. Its uniform thickness and flexible consistency make it simple to cut to size and place between uneven surfaces, ensuring reliable contact and reduced maintenance compared with thermal greases. The non-liquid form reduces the risk of spreading or migration, and the pad remains stable under normal operating temperatures encountered in computing and industrial contexts.

Suitable for

• Thermal coupling between CPUs/GPUs and heatsinks in desktop and small-form-factor PCs
• Cooling of power modules, voltage regulators and MOSFET arrays on motherboards and power supplies
• Thermal interface for LED assemblies and lighting fixtures
• Industrial electronics where a compact, reliable thermal interface is required

Key specifications

• Thermal conductivity: 7 W/mK
• Dimensions: 120 × 20 × 1 mm
• Form: solid gel pad, conformable
• Application type: thermal interface material for component-to-heatsink contact
• Compatibility: suitable for electronic components such as CPUs, GPUs, power modules and LEDs

How to use

Select a pad piece slightly larger than the contact area and trim to the required size with clean scissors or a sharp blade. Clean both mating surfaces of dust, old thermal compound and grease before application. Place the Gelid thermal pad directly onto the component or heatsink and align the mating part; apply gentle pressure to ensure full surface contact and fill any gaps. Reassemble the device according to manufacturer instructions and verify proper mechanical seating of the heatsink. Replace the pad if it shows signs of deformation, contamination or degraded contact over time.

Usage recommendations

For best thermal performance, ensure mating surfaces are clean and flat where possible; avoid overstretching or compressing the pad beyond intended thickness. Use appropriately sized pieces to prevent shorting of nearby electrical contacts and follow device-specific clearance and mounting guidelines. Inspect the thermal pad periodically in demanding environments and replace it if thermal transfer degrades.