Thermal pad Gelid Extreme TP-VP05-B 120×20×1.0 mm, 2 pcs

The Gelid Extreme thermal pad is a high-performance thermal interface material designed to bridge the gap between heat-generating components and cooling solutions. Measuring 120×20×1.0 mm, this set includes two pre-cut pads that ensure efficient heat dissipation for various electronic devices. By filling microscopic air gaps, these pads facilitate optimal thermal conductivity, preventing overheating and extending the lifespan of sensitive hardware components.

Advantages

These thermal pads offer excellent thermal conductivity, ensuring that heat is effectively transferred away from processors, memory modules, and power delivery components to the heatsink. Their soft and flexible texture allows them to conform perfectly to uneven surfaces, providing a reliable contact area without putting excessive pressure on delicate components. Furthermore, the material is electrically non-conductive, which minimizes the risk of short circuits during installation and operation. The pre-cut dimensions simplify the application process, making it an ideal solution for both professional technicians and DIY enthusiasts looking to improve their system's thermal management.

Suitable for

• PC cooling systems and graphics card memory modules
• Power supply units and voltage regulator modules
• LED lighting modules requiring heat dissipation
• General electronics assemblies and heat-sensitive components

When it may not be suitable

This thermal pad is not intended for use as a substitute for thermal paste on high-pressure contact surfaces like CPU integrated heat spreaders, where a thinner interface is required. It is also not suitable for applications involving extreme temperatures exceeding the manufacturer's specified thermal limits.

Key specifications

• Dimensions: 120×20×1.0 mm
• Quantity: 2 pieces per pack
• Thermal conductivity: High-performance grade
• Electrical properties: Non-conductive
• Material: Soft, conformable thermal interface material

How to use

Before installation, ensure that the surfaces of both the heat-generating component and the heatsink are clean, dry, and free of dust or old thermal material. Remove the protective film from one side of the thermal pad and carefully place it onto the component. Once positioned, remove the remaining protective film and attach the heatsink, ensuring even pressure is applied across the surface to secure the connection.

What to consider before purchase

• Verify the required thickness for your specific hardware gap
• Ensure the surface area matches the 120×20 mm dimensions
• Check that the component surface is clean before application

Usage recommendations

For optimal performance, ensure that the heatsink is mounted with consistent pressure to allow the pad to compress slightly and fill all air gaps effectively. Avoid reusing the pads once they have been compressed or contaminated.