Thermal pad Gelid PH-GC-01-A, 40×40×0.2 mm, thermal conductivity 8.5 W/m·K

Gelid PH-GC-01-A is a thin thermal pad sized 40×40×0.2 mm designed to improve heat transfer between electronic components and heatsinks. With a thermal conductivity of 8.5 W/m·K, this single-pad pack is intended for filling small gaps and ensuring consistent thermal contact on chips, MOSFETs, VRMs and other compact electronic assemblies where a slim, conformable interface material is required.

Advantages

The thermal pad offers a balance of thin profile and relatively high thermal conductivity for its class, enabling improved heat dissipation without changing component spacing. Its pre-cut dimensions simplify placement and reduce trimming. Supplied as a single pad per pack, it is convenient for targeted repairs or precise thermal management tasks where a small, reliable interface layer is needed.

Suitable for

• Filling small gaps between chips and heatsinks
• Thermal contact for MOSFETs and VRM modules
• Thermal interface on compact motherboards and small PCBs
• Targeted repairs and component-level thermal upgrades

Key specifications

• Dimensions: 40 × 40 × 0.2 mm
• Thermal conductivity: 8.5 W/m·K
• Form: thin, conformable thermal pad
• Pack quantity: 1 pad per pack

How to use

Clean both contact surfaces to remove dust, grease and old thermal materials before installation. Peel protective liners from the pad if present, align the pad over the component or gap, and press gently to ensure full contact without trapping air. If trimming is required, cut the pad to size with clean scissors before removing the protective liner. Reassemble the device and verify secure mechanical mounting of the heatsink to maintain pressure across the pad.

Usage recommendations

Use the Gelid PH-GC-01-A thermal pad for small, low-clearance interfaces where a thin, pre-cut pad is preferred. Avoid using the pad in locations requiring electrical insulation beyond the pad's intended purpose; verify compatibility with component temperatures and mechanical tolerances in your system before prolonged operation.