Thermal pad Gelid HeatPhase Ultra PTM 100x100x0.2mm - Gelid PH-GC-02

Gelid HeatPhase Ultra PTM is a thin thermal pad designed to provide a reliable conductive interface between electronic components and heatsinks. Measuring 100 × 100 × 0.2 mm, this pad offers a balance of thermal transfer and conformability for tight gaps and low-profile assemblies. The material provides electrical insulation while filling microscopic surface irregularities to improve contact and heat dissipation for CPUs, VRMs, chipsets and other components in desktops, servers and compact systems.

Advantages

The Gelid HeatPhase Ultra PTM pad delivers stable thermal conduction with low thickness, allowing efficient heat transfer in confined spaces without adding significant thermal resistance. Its conformable surface adapts to uneven contact areas, improving overall thermal contact. The electrically insulating nature reduces the risk of short circuits when applied near exposed contacts. The uniform thickness and sheet format simplify handling and placement compared with liquid compounds for applications that require tidy, repeatable interfaces.

Suitable for

• Thermal bridging between heatsinks and CPUs or chipsets in desktop and small form factor PCs
• VRM cooling and power delivery component thermal interfaces on motherboards
• Thermal contact in servers and network equipment with compact layouts
• Cooling of discrete components where thin, non-liquid interface materials are preferred

Key specifications

• Dimensions: 100 × 100 × 0.2 mm
• Material type: thermally conductive pad (gel/phase material)
• Electrical properties: electrically insulating
• Conformability: designed to fill microscopic surface irregularities
• Application form: cuttable sheet for precise placement

How to use

Clean contact surfaces to remove dust, grease and old thermal residue, ensuring dry and stable mounting areas. Cut the pad to the required shape and size for the component and remove any protective liners if present. Place the pad onto the component or heatsink, align carefully and assemble the heatsink with even, moderate pressure to establish full contact. Avoid stretching the pad excessively when cutting or positioning; maintain flat alignment to ensure uniform thermal transfer.

Usage recommendations

For best results, use the pad in applications with small gaps and limited vertical clearance where a thin, electrically insulating interface is needed. Replace the pad if it becomes contaminated, compressed beyond recovery, or shows physical damage. Store unused sheets in a clean, dry environment away from extreme temperatures to preserve material properties.