Thermal pad Gelid HeatPhase Ultra, 8.5 W/m·K, 40×30×0.2 mm

Gelid HeatPhase Ultra is a thermal pad designed to improve heat transfer between electronic components and heatsinks. The single pad in this pack measures 40 × 30 × 0.2 mm and provides a thermal conductivity rating of 8.5 W/m·K. It is suitable for filling small gaps on PCBs, VRMs, memory modules and other compact components where improved thermal contact is required.

Advantages

HeatPhase Ultra offers a fixed-thickness thermal interface that enhances thermal conduction between components and cooling solutions. Its phase-change characteristics allow for consistent surface contact at operating temperatures, helping to reduce thermal resistance. The pad is non-curing and formulated to avoid electrical conductivity, making it appropriate for use near sensitive circuitry. Its thin profile is intended for applications with minimal gap clearance while providing a stable thermal path.

Suitable for

• Heat transfer between small electronic components and heatsinks
• Gap filling on PCBs and around VRMs
• Thermal contact enhancement on memory modules and compact chips
• Where a thin, non-curing thermal pad is required

Key specifications

• Thermal conductivity: 8.5 W/m·K
• Dimensions: 40 × 30 × 0.2 mm
• Form factor: single thin thermal pad
• Intended use: gap filling and thermal interface between small components and heatsinks

How to use

Before installation, ensure both the component surface and heatsink are clean, dry and free of dust or grease. Remove any protective liners from the pad and place it directly between the component and the heatsink, aligning the pad to fully cover the contact area without overhanging electrical contacts. Apply even pressure when mounting the heatsink to achieve full surface contact. Do not stretch or fold the pad during placement.

Usage recommendations

Use Gelid HeatPhase Ultra where thin, high-conductivity gap filling is required and where the pad’s non-curing nature and non-electrical conductive formulation are suitable. Verify compatibility with component clearances and avoid use on uneven or heavily textured surfaces that may prevent full contact.