Thermal paste Gelid GC-4 transparent 3.5 g, density 2.3 g/cm³, operating temp 30–150°C

Gelid GC-4 transparent thermal paste, supplied in a 3.5 g pouch, is formulated to improve heat transfer between electronic components and heatsinks. With a density of 2.3 g/cm³ and an operating temperature range from 30 to 150°C, this transparent compound fills microscopic surface irregularities to reduce thermal resistance and support more efficient cooling of CPUs, GPUs and other heat-generating chips. The product is designed for use in applications where a thin, stable thermal interface is required and includes an applicator for controlled placement.

Advantages

Gelid GC-4 combines a polymer matrix with an engineered micron-particle thermal filler to provide consistent thermal contact and appropriate viscosity for precision application. Its transparent colour facilitates visual alignment during installation. The compound is formulated to be non-electrically conductive and maintains performance across the stated operating temperature range, supporting reliable heat transfer in small form-factor and conventional cooling solutions.

Suitable for

• Thermal interface between CPU/GPU and heatsink in desktop and small form-factor systems
• Cooling of chipsets and power components on motherboards and add-in cards
• Repair or replacement of thermal paste during routine maintenance or upgrades

Key specifications

• Net weight: 3.5 g
• Density: 2.3 g/cm³
• Operating temperature range: 30–150 °C
• Colour: Transparent
• Packaging: Polybag with applicator included

How to use

Prepare the surfaces by powering down the device and removing the heatsink following the manufacturer's instructions. Clean both the component and heatsink contact surfaces thoroughly with isopropyl alcohol and allow them to dry. Apply a small, pea-sized amount of Gelid GC-4 to the centre of the chip or a thin, even line where appropriate; the included applicator can be used to spread the compound into a thin, continuous layer. Reattach the heatsink, ensuring even mounting pressure to form a thin, uniform thermal interface. Avoid excessive amounts; a thin layer is sufficient for optimal conduction.

Usage recommendations

Use Gelid GC-4 for standard CPU/GPU thermal interface tasks and routine maintenance where a transparent, non-electrically conductive compound with a 30–150 °C operating range is suitable. Store the pouch in a cool, dry place and reseal packaging after use. If performing high-performance overclocking or extreme cooling beyond the stated temperature range, consult system specifications and consider a thermal solution rated for wider extremes.