Thermal paste Gelid GC-Pro thermal compound 7 W/m·K, 5 g

Gelid GC-Pro thermal compound is a high-performance thermal paste with a thermal conductivity of 7 W/m·K supplied in a 5 g tube. Engineered to improve heat transfer between CPUs, GPUs and heatsinks or cold plates, the compound fills microscopic gaps and uneven surfaces to reduce operating temperatures and support reliable component cooling. The formulation is non-electrically conductive, non-corrosive, non-curing and non-toxic, and the product is supplied with a GELID applicator for precise, user-friendly application.

Advantages

The GC-Pro offers best-in-class heat conductivity while maintaining safety characteristics such as non-electrical conductivity and non-corrosive behavior. Its nanoscale ultra-fine molecular structure enables better gap filling than many conventional pastes, promoting uniform thermal contact and improved heat transfer. The compound does not cure or bleed over time, and the included applicator simplifies even distribution on CPU, GPU or chipset surfaces.

Suitable for

• Thermal maintenance of desktop and laptop CPUs and GPUs
• Heatsink and cold plate mounting for processors and graphics cards
• Overclocking and high-performance system cooling
• Repair, upgrade or routine service of cooling systems in PCs and workstations

Key specifications

• Thermal conductivity: 7 W/m·K
• Net weight: 5 g
• Non-electrically conductive formulation
• Non-corrosive, non-curing and non-toxic
• No bleeding during normal operation
• Includes GELID applicator for controlled application

How to use

Clean both the processor or GPU heat spreader and the heatsink contact surface using a lint-free cloth and isopropyl alcohol, then allow surfaces to dry. Apply a small, pea-sized amount or a thin line of Gelid GC-Pro to the center of the processor die or the designated contact area. Mount the heatsink and secure it according to the manufacturer’s instructions, allowing the compound to spread under pressure for uniform coverage. For multi-chip modules or larger contact areas, use the applicator to distribute the paste evenly while avoiding excessive quantity that could impede heat transfer.

Usage recommendations

Use only the necessary amount to ensure a thin, continuous thermal interface. Reapply the thermal compound when replacing or removing a heatsink, or if operating temperatures rise unexpectedly. Store the tube in a cool, dry place and keep the cap tightly closed to prevent contamination and drying of the compound.