Thermal compound Gelid GC-Extreme 8.5 W/m·K, 3.5 g heat sink paste

Gelid GC-Extreme is a high-performance thermal compound supplied in a 3.5 g tube, designed to improve heat transfer between CPUs, GPUs and heatsinks. With a thermal conductivity of 8.5 W/m·K, this paste fills microscopic gaps and uneven surfaces to reduce thermal resistance and support effective cooling in desktop processors, graphics cards and chipset cooling upgrades. The product is non-electrically conductive, non-corrosive, non-curing and non-toxic, and comes with a GELID applicator for controlled placement.

Advantages

The compound provides very high thermal conductivity (8.5 W/m·K) for efficient heat transfer. It is non-electrically conductive to reduce the risk of short circuits, non-corrosive to protect components and non-toxic for safer handling. The included GELID applicator and 3.5 g net content allow precise, user-friendly application without bleeding or curing.

Suitable for

• Desktop CPUs
• Discrete graphics cards (GPUs)
• Chipset and small form-factor cooling upgrades

Key specifications

• Thermal conductivity: 8.5 W/m·K
• Net content: 3.5 g
• Electrical properties: non-electrically conductive
• Chemical/physical properties: non-corrosive, non-curing, non-toxic
• Application aid: GELID applicator included

How to use

Clean and dry both the processor/GPU surface and the heatsink contact area before application. Apply a small amount of thermal compound onto the center of the chip and spread evenly with the applicator or allow the heatsink pressure to distribute the paste when mounting. Reassemble the cooler, ensuring even pressure and proper mounting to achieve consistent thermal contact.

Usage recommendations

Use sparingly: a thin, even layer is sufficient. Replace the compound when removing or replacing the cooler, and avoid contaminating surfaces with dust or grease to maintain optimal thermal performance.