Thermal putty Gelid GN-Ultimate 6W 30g — high-conductivity thermal interface compound

Gelid GN-Ultimate 6W 30g is a high-conductivity thermal putty engineered as a thermal interface compound for CPUs, GPUs and other heat-generating components. Supplied in a 30 g tube, the compound features a specified thermal conductivity of 6 W/m·K and a paste-like consistency designed to fill microscopic gaps between heatsink and chip. The formulation is intended for desktop cooling, overclocking and maintenance tasks where a reusable, pliable thermal interface is required.

Advantages

The thermal putty provides improved heat transfer by eliminating air pockets at the contact surface and ensuring even thermal contact between the heatsink and the component. Its 6 W thermal conductivity rating reflects the compound's capacity to conduct heat away from the source. Supplied in a 30 g tube, the product offers enough material for multiple applications and reapplications. The paste-like, reusable consistency allows for repositioning and repeated use during system assembly and testing.

Suitable for

• Desktop CPU and GPU cooling applications
• Overclocking setups requiring improved thermal contact
• System maintenance, heatsink replacement and testing
• Custom cooling solutions and DIY PC builds

Key specifications

• Thermal conductivity: 6 W/m·K
• Net weight: 30 g (tube)
• Consistency: paste-like, reusable putty
• Application area: CPU, GPU and other heat-generating components
• Form factor: syringe/tube for controlled dispensing

How to use

Before application, power down the system and disconnect from mains. Clean both the heatsink base and chip surface thoroughly with isopropyl alcohol and a lint-free cloth to remove old thermal material, dust and oils. Apply a small, even amount of Gelid GN-Ultimate 6W to the centre of the chip or use a thin film across the surface depending on the size of the contact area. Mount the heatsink and apply even pressure to spread the compound and establish full contact; avoid excessive force. After installation, monitor operating temperatures to confirm correct application and reapply only after removing and cleaning surfaces when necessary.

Usage recommendations

Use minimal quantities necessary to achieve complete contact; excess compound can squeeze out and may affect adjacent components. Store the tube capped in a cool, dry place away from direct sunlight. For best results during overclocking or heavy loads, verify thermal performance after a controlled stress test and reapply if thermal interface degradation is observed.