Thermal putty Gelid GN-Ultimate 10W 30 g - Gelid TN-GN10-01

Gelid GN-Ultimate 10W 30 g is a thermal putty formulated to improve heat transfer between electronic components and heatsinks. Supplied as a 30 g tube of viscous, malleable compound, the putty is intended to fill microscopic surface irregularities and air gaps to enhance conduction for CPUs, GPUs, MOSFETs and other power devices. The product is suitable for system assembly, cooling upgrades and component repair where a conforming interface material is needed.

Advantages

The formulation provides a high thermal conductance value intended to reduce thermal resistance at the interface and improve heat dissipation from hot components to heatsinks. Its putty-like consistency allows it to be spread or pressed into uneven surfaces and recessed areas, maintaining contact without hardening. The 30 g quantity is convenient for multiple applications or larger contact areas, and the compound is designed for stable performance under typical operating temperatures of consumer and industrial electronics.

Suitable for

• Thermal interface material for CPUs and desktop cooling assemblies
• GPU cooling and repasting of graphics cards
• Thermal contact for MOSFETs, voltage regulators and power transistors
• Repairing or optimizing heat transfer in custom electronics and embedded systems

Key specifications

• Form: viscous, malleable putty compound
• Net quantity: 30 g of thermal compound
• Thermal conductance (manufacturer designation): 10 W
• Primary purpose: fill gaps and improve thermal interface between component and heatsink
• Compatibility: designed for use with CPUs, GPUs, power semiconductors and heatsinks

How to use

Prepare both surfaces by powering down the device and removing old thermal material with an appropriate solvent and lint-free cloth. Apply a small amount of the putty to the component or heatsink contact area and spread or press it to achieve an even, thin layer that fills surface irregularities. Reassemble the cooling solution ensuring even pressure across the interface to distribute the compound and eliminate trapped air. Allow the assembly to reach operating temperature during initial use to settle the putty into microscopic gaps.

Usage recommendations

Use the compound in well-ventilated areas and avoid contamination of surrounding components. For best thermal results, avoid overapplication; a thin, even layer that fills gaps is more effective than thick excess. Check mounting pressure and re-torque fasteners according to component manufacturer guidelines after installation. Store the product in a cool, dry place and reseal the container to prevent drying or contamination when not in use.