Thermal putty Gelid GN-Ultimate 10W 50g — high-conductivity heat compound

Gelid GN-Ultimate 10W thermal putty is a high-conductivity heat transfer compound supplied in a 50 g container. Formulated to improve thermal contact between electronic components and heatsinks, the putty fills uneven gaps and maintains reliable thermal coupling during installation and maintenance. Its paste-like consistency allows controlled application on CPUs, GPUs, power devices and other components where efficient heat dissipation is required.

Advantages

The thermal putty offers high thermal conductivity rated at 10 W, enabling more efficient heat transfer compared with standard thermal greases. The 50 g amount is suited for multiple applications or larger surfaces, reducing the need for frequent repurchase. The putty form reduces the risk of run-off and makes it easier to fill irregular surfaces, providing consistent contact pressure and minimizing thermal resistance. The compound is non-electrically conductive, facilitating safe application near sensitive circuits when used according to manufacturer guidance.

Suitable for

• Desktop and server CPUs and GPUs where improved heat transfer is needed
• Power transistors, MOSFETs and voltage regulators on power boards
• Heatsink-to-package interfaces with uneven mating surfaces
• Custom cooling solutions and aftermarket thermal upgrades

Key specifications

• Form: thermal putty / paste
• Thermal performance: rated 10 W
• Net weight: 50 g
• Application type: gap filling and contact enhancement between components and heatsinks
• Compatibility: suitable for silicon-based CPUs, GPUs and power devices

How to use

Prepare the mating surfaces by cleaning off old thermal material and any grease or dust using isopropyl alcohol and a lint-free cloth. Apply a thin, even layer of the putty to the component surface or heatsink, using a plastic spreader or a gloved finger to ensure uniform coverage and to fill micro-gaps. Mount the heatsink with even pressure to achieve proper seating and thermal contact. After installation, verify temperatures under normal load and, if necessary, re-seat and add a small amount of compound to improve contact.

Usage recommendations

Store the product in a cool, dry place and reseal the container after use to prevent drying. Use appropriate personal protective equipment such as gloves; avoid contact with skin and eyes. Do not use excessive amounts — a thin, even layer achieves optimal thermal transfer. Follow device manufacturer guidelines for allowed thermal compounds and safe rework procedures.