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Thermal pad Gelid Solutions GP-Extreme
The Thermal pad Gelid Solutions GP-Extreme is a grey thermal interface pad sized 80×40×1 mm, designed to improve heat transfer between PCB-mounted components and heatsinks. With a thermal conductivity of 12 W/m·K, it fills gaps and compensates for height differences and uneven surfaces on PCBs to provide reliable thermal contact for components such as memory ICs, microcontroller units and other SMD parts.
GP-Extreme combines high thermal conductivity with a soft, conformable structure that ensures good surface contact and efficient heat dissipation. The pad is non-electrically conductive, non-corrosive, non-curing and non-toxic, which simplifies handling and long-term use. Its 80×40 mm size is suitable for larger PCB areas such as VGA cards and high-speed HDD assemblies.
Clean both the component and heatsink contact surfaces from dust, grease and old thermal material. Cut the GP-Extreme pad to the required shape if necessary, remove the protective film, and position the pad between the component and heatsink. Apply even pressure to ensure the pad conforms to surface irregularities and establishes full contact. Reassemble the device and verify mechanical clearance before powering on.
If used on boards with exposed electrical contacts, ensure correct placement to avoid covering conductive pads. Store the pad in a cool, dry place away from direct sunlight and avoid stretching or tearing during installation.
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