Thermal pad Gelid GP-Extreme, thermal interface pad 80×40×3 mm, density 2.8 g/cm³, 1 pc

GP-Extreme Thermal Pad Series is a high-performance thermal pad designed to ensure reliable thermal contact between heatsinks and PCBs with uneven surfaces or height differences. It is suitable for use with micro-controller units, memory ICs, analog ICs, MOSFETs and other SMD components. The pad’s softness and high thermal conductivity allow it to conform to gaps and provide efficient heat transfer. The product is non-electrically conductive, non-corrosive, non-curing and non-toxic, and is supplied in a size of 80×40 mm to fit larger PCB areas found in VGA cards, laptops, gaming consoles and other densely packed devices.

Advantages

The GP-Extreme offers excellent thermal conductivity while remaining soft enough to fill uneven surfaces and compensate for height variations. Its electrical insulation prevents short circuits, and its non-corrosive, non-curing and non-toxic composition makes handling and long-term use safe. The standard 80×40 mm sheet size covers larger component clusters, simplifying installation on graphics cards, notebooks and compact electronics.

Key specifications

• Type: Thermal pad
• Dimensions: 80 × 40 mm
• Density: 2.8 g/cm³
• Quantity: 1 pc
• Electrical property: Non-electrically conductive
• Chemical and safety: Non-corrosive, non-curing, non-toxic

How to use

Clean the PCB and heatsink contact areas from dust, grease and residues. Cut the GP-Extreme thermal pad to the required shape and size, remove protective liners and place the pad between the component and the heatsink. Apply even pressure to ensure the pad conforms to surface irregularities and establishes good thermal contact. Reassemble the device and verify component alignment before powering on.

Recommendations

Store the thermal pad in a clean, dry environment away from direct sunlight. For optimal thermal performance, ensure full contact between the pad and both surfaces; replace the pad if it becomes damaged or contaminated. Avoid using the pad where direct electrical conduction is required.